UWP1E3R3MCL1GB

The UWP1E3R3MCL1GB is a chip-type, bi‑polar aluminum electrolytic capacitor in a compact surface-mount radial can package. It offers 3.3 µF capacitance at 25 V with ±20% tolerance, designed for automatic mounting and high-density PCB assembly.

Engineered for reliability in demanding environments, this part is AEC‑Q200 qualified, RoHS compliant and rated for 1000 hours at 85°C. Key electrical characteristics include low leakage, controlled loss tangent and defined ripple-current capability at both low and high frequencies.

Key Features

• Electrical Performance — 3.3 µF capacitance at 25 V with ±20% tolerance; tanδ 0.17 (max) at 20°C, 120 Hz for stable AC characteristics.
• Low Leakage — Leakage current specified at 10 µA (or 0.05CV, whichever is greater) after rated voltage application, supporting low‑current and precision circuitry.
• Ripple Current Ratings — Rated ripple current of 12 mA at 120 Hz and 18 mA at 10 kHz to support smoothing and decoupling across a range of operating frequencies.
• Reliability & Endurance — Endurance: 1000 hours at 85°C with polarity inversion every 250 hours; post‑test limits include capacitance change within ±20% and leakage no greater than initial specification.
• Automotive Qualification — AEC‑Q200 rated, making it suitable for automotive electronics and other applications requiring component-level qualification.
• SMD Packaging & Assembly — Chip‑type radial can for surface mount; supplied on embossed carrier tape for automatic mounting and mass production workflows.
• Operating Environment — Rated for operation from −40°C to +85°C to cover a broad temperature envelope in commercial and automotive systems.
• Compact Footprint — Case size φ5 × 5.4 mm with recommended land size 5.3 × 5.3 mm for high‑density board layouts.

Typical Applications

• Automotive electronic modules — Suitable for use in automotive control assemblies where AEC‑Q200 qualification and robust endurance at elevated temperature are required.
• SMD power filtering — Compact chip form and defined ripple‑current capability make it appropriate for local decoupling and smoothing on compact power rails.
• High‑density PCB assemblies — Designed for surface mounting on tight board real estate and compatible with automated carrier‑tape pick‑and‑place processes.

Unique Advantages

• Bi‑polar construction: Enables use in AC‑coupled or polarity‑variable circuits without single‑polarity constraints.
• AEC‑Q200 qualification: Provides a documented qualification path for automotive and other high‑reliability applications.
• Mass‑production ready: Embossed carrier taping and chip SMD format streamline automated assembly and reduce handling complexity.
• Durability at elevated temperature: 1000‑hour endurance at 85°C with defined post‑test limits ensures predictable long‑term behavior under stress.
• Measured AC performance: Specified tanδ and frequency ripple‑current ratings allow designers to match capacitor behavior to system frequency content.

Why Choose UWP1E3R3MCL1GB?

UWP1E3R3MCL1GB combines compact SMD packaging, bi‑polar electrode construction and automotive‑grade qualification to deliver a reliable capacitor option for designers of compact, high‑density electronics. Its controlled leakage, defined tanδ and ripple current specifications give engineers measurable parameters to design around for filtering and decoupling tasks.

This part is well suited for teams building production assemblies where automated placement, RoHS compliance and proven endurance at elevated temperatures are required. The combination of form factor, qualification and specification transparency supports predictable integration into automotive and other demanding product lines.

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