UWR0J560MCL1GB

The UWR0J560MCL1GB is a surface-mount aluminum electrolytic chip capacitor in the Nichicon UWR series designed for high-density PCBs and automated assembly. It provides 56 µF capacitance at a 6.3 V rating with a compact φ5 × 5.4 mm can-style (chip) package and embossed carrier taping for pick-and-place compatibility.

Targeted at demanding electronic assemblies, this part combines a wide operating temperature range of −40 °C to 85 °C, AEC-Q200 recognition, and RoHS compliance to meet stringent reliability and regulatory requirements.

Key Features

• Capacitance & Voltage — 56 µF capacitance rated at 6.3 V, with a tolerance of ±20% suitable for bulk decoupling and smoothing in compact designs.
• Compact SMD Chip Package — Chip/can SMD package sized φ5 × 5.4 mm (L: 5.4 × D: 5 mm) for surface-mount placement on high-density printed circuit boards.
• Ripple Performance — Low-frequency ripple current of 46 mA (120 Hz) and high-frequency ripple current of 69 mA (10 kHz) to support typical power-conditioning tasks.
• Leakage & Loss — Specified leakage current of 3.528 µA and a tangent of loss angle (tan δ) of 0.3 measured at 20 °C, 120 Hz for predictable leakage and dissipation behavior.
• Endurance & Temperature — Rated for 2000 hours at 85 °C and an operating temperature range of −40 °C to 85 °C, supporting long-duration performance in elevated-temperature environments.
• Automotive-Grade & Compliance — AEC-Q200 rated and RoHS compliant, addressing regulatory and reliability expectations for automotive and regulated electronics.
• Assembly-Friendly Packaging — Supplied on embossed carrier tape to support automated pick-and-place assembly processes.

Typical Applications

• Automotive electronics — For control modules and electronic subsystems that require AEC-Q200 recognition and operation across −40 °C to 85 °C.
• High-density surface-mount assemblies — Chip-style can package is intended for space-constrained PCBs where surface-mount placement is required.
• Automated manufacturing — Embossed carrier taping enables use with automatic mounting machines for high-volume production.

Unique Advantages

• Compact footprint: φ5 × 5.4 mm chip package delivers 56 µF capacitance in a small SMD form factor, helping reduce board area for power filtering.
• Automotive-capable construction: AEC-Q200 rating combined with −40 °C to 85 °C operation supports use in regulated automotive-grade designs.
• Predictable endurance: 2000-hour rated life at 85 °C provides measurable long-term performance expectations for thermal stress conditions.
• Assembly-ready packaging: Embossed carrier tape format simplifies integration into automated pick-and-place workflows and streamlines PCB assembly.
• Regulatory compliance: RoHS compliance ensures the part meets required environmental directives for electronic components.
• Balanced ripple and leakage characteristics: Defined low/high ripple current ratings and specified leakage current enable reliable filtering and decoupling in power circuits.

Why Choose UWR0J560MCL1GB?

UWR0J560MCL1GB provides a compact, automotive-capable electrolytic solution for designers needing 56 µF at 6.3 V in a surface-mount chip package. With AEC-Q200 recognition, RoHS compliance, embossed carrier taping, and a rated life of 2000 hours at 85 °C, it is positioned for applications that require predictable endurance, automated assembly compatibility, and a small footprint.

This part is well suited for engineers building space-constrained, production-sourced electronics where board-level smoothing and decoupling must meet automotive-grade reliability and manufacturing flow requirements.

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