UWT0G152MNL1GS

The UWT0G152MNL1GS is a chip-type aluminum electrolytic capacitor from Nichicon's UWT series. It delivers 1.5 mF capacitance at a 4 V rating in a compact surface-mount radial can package designed for high-density PC boards.

Engineered for demanding temperature environments and automated assembly, this RoHS‑compliant capacitor is AEC‑Q200 qualified and specified for automotive applications, offering defined ripple current performance and 1000 hours endurance at 105°C.

Key Features

• Capacitance & Voltage — 1.5 mF rated capacitance at 4 V with ±20% tolerance (specified at 120 Hz, 20°C).
• Wide Temperature Range — Operating range from −55°C to +105°C for use across broad thermal environments.
• Automotive Qualification — AEC‑Q200 Qualified and listed for Automotive applications in the product specifications.
• Surface-Mount Chip Package — Chip-type radial can SMD form factor designed for surface mounting on high-density PC boards and compatible with carrier-tape feeding for automatic mounting machines.
• Endurance & Reliability — Rated for 1000 hours at 105°C with specified limits on capacitance change (within ±25% for capacitors ≤16 V), tan δ and leakage current after test.
• Ripple Current — Specified ripple current of 310 mA at 120 Hz and 465 mA at 10 kHz.
• Leakage Current & Dissipation — Leakage current after 2 minutes at 20°C is specified as ≤ 0.01CV or 3 μA (whichever is greater); tan δ (max) for 4 V rating is 0.40.
• Polarized — Polarized aluminum electrolytic construction for DC applications requiring polarity-aware placement.
• Compact Footprint — Physical size L × D: 1 × 1 cm with recommended land pattern L × W: 1.03 × 1.03 cm for surface-mount layout.
• RoHS Compliance — Compliant to the RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronics — Suited for automotive electronic modules that require AEC‑Q200 qualification and broad temperature operation.
• High-density SMD assemblies — Provides 1.5 mF capacitance in a 1 × 1 cm chip form factor to save board area on compact PCBs.
• Automated assembly lines — Designed for surface mounting and compatible with carrier-tape feeding for automatic mounting machines.

Unique Advantages

• Wide operating temperature tolerance — −55°C to +105°C specification supports designs that must operate across extreme thermal ranges.
• Automotive-grade qualification — AEC‑Q200 qualification addresses validation needs for automotive applications and related quality programs.
• High capacitance in compact SMD package — 1.5 mF in a 1 × 1 cm chip reduces PCB area compared with larger through-hole alternatives.
• Assembly-friendly packaging — Carrier-tape compatibility and SMD chip design simplify integration into automated pick-and-place processes.
• Specifiable endurance and ripple limits — 1000 hours at 105°C endurance and defined ripple current ratings (120 Hz and 10 kHz) enable predictable performance planning.
• Regulatory compliance — RoHS directive compliance supports regulatory and environmental requirements.

Why Choose UWT0G152MNL1GS?

The UWT0G152MNL1GS combines a high 1.5 mF capacitance with a compact SMD chip form factor and a wide −55°C to +105°C operating range, making it suitable for designs that require dense board integration and defined thermal robustness. AEC‑Q200 qualification and RoHS compliance provide traceable specification points for automotive and regulated applications.

This part is appropriate for engineers specifying capacitors for compact, automated assemblies where predictable endurance (1000 hours at 105°C), leakage, and ripple current characteristics are required. Its footprint and carrier-tape compatibility simplify automated production while delivering verifiable electrical and environmental specifications.

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