UWT1E101MCL1GS

The UWT1E101MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface mounting on high-density printed circuit boards. It delivers a 100 µF capacitance at 25 V in a compact radial can SMD package and is applicable for automatic placement using carrier tape.

Engineered for wide temperature operation from −55 °C to +105 °C, the part is AEC-Q200 qualified and RoHS compliant, and is specified for 1000 hours of endurance at 105 °C, making it suitable for demanding temperature and reliability requirements.

Key Features

• Package and Mounting: Chip-type radial can SMD package designed for surface mounting on high-density PC boards; compatible with automatic mounting machines fed with carrier tape. Package dimensions: L: 7.7 × D: 6.3 mm; surface mount land size: 6.6 × 6.6 mm.
• Capacitance & Voltage: 100 µF rated capacitance at 25 V with ±20% tolerance and polarized construction.
• Wide Temperature Range: Specified to operate from −55 °C to +105 °C to support applications with extended ambient ranges.
• Endurance: Lifetime specified as 1000 hours at 105 °C; endurance recovery is measured after restoration to 20 °C per the datasheet.
• Ripple Current Ratings: 91 mA at 120 Hz (low frequency) and 136.5 mA at 10 kHz (high frequency), enabling handling of common ripple conditions.
• Soldering Robustness: Meets soldering heat resistance requirements after a 30-second exposure on a 250 °C hot plate as specified in the datasheet.
• Standards & Compliance: AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronic Control Units (ECUs): AEC-Q200 qualification and −55 °C to +105 °C operation make this capacitor suitable for vehicle electronic modules requiring SMD power components.
• Infotainment and Instrumentation Modules: Compact SMD radial can and 100 µF value support space-constrained power supply circuits operating across wide temperature ranges.
• High-density Surface-mount Power Boards: Designed for automated placement on high-density PCBs where carrier-tape fed assembly is used.

Unique Advantages

• AEC-Q200 Qualification: Provides a documented automotive-grade reliability level for designs that require qualified components.
• Wide Operating Temperature: −55 °C to +105 °C rating helps maintain performance across extreme environmental conditions.
• Compact SMD Form Factor: Small footprint (7.7 × 6.3 mm) and defined land pattern (6.6 × 6.6 mm) simplify layout on high-density PCBs.
• Proven Endurance: 1000 hours at 105 °C endurance rating supports long-term thermal stress performance in qualifying applications.
• Assembly-friendly: Compatible with carrier-tape fed automatic mounting to support efficient production workflows.
• Regulatory Compliance: RoHS compliance ensures conformance to common environmental directives.

Why Choose UWT1E101MCL1GS?

UWT1E101MCL1GS is positioned for engineers designing compact, surface-mount power systems that require stable capacitance, AEC-Q200 qualification, and operation across a wide temperature window. Its combination of a 100 µF/25 V rating, small radial can SMD footprint, and defined endurance at elevated temperature offers a balance of reliability and board-space efficiency.

This part is well suited for teams building automotive electronics and other high-reliability surface-mount assemblies where automated placement, RoHS compliance, and defined ripple/endurance characteristics are required.

Request a quote or contact sales to discuss pricing, availability, and lead times for UWT1E101MCL1GS and to obtain technical support for integration into your design.