UWZ1C221MCL1GS

CAP ALUM 220UF ±20% 16V SMD
Part Description

220 µF 16 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,031 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUWZ
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance220 µFECCNEAR99
ESRN/AHeight Seated (Max)8 mmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp1000 h @ 105°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-55°C - 105°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency157.5 mA @ 100 kHzRipple Current Low Frequency105 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension7.7 x 6.3 mmSurface Mount Land Size6.6 x 6.6 mm
Tolerance-20%~20%Voltage16 V

Overview of UWZ1C221MCL1GS – Chip Type Aluminum Electrolytic Capacitor (220 µF, 16 V)

The UWZ1C221MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon’s UWZ series, specified at 220 µF and 16 V. It is designed for surface-mount assembly and automated placement (carrier tape compatible) and is intended for use in automotive applications where wide temperature operation and reliable reflow performance are required.

Key value propositions include a wide operating temperature range (–55 to +105 °C), qualification to AEC-Q200, and compatibility with high-temperature (260 °C peak) reflow processes—enabling SMT assembly and sustained operation in demanding thermal environments.

Key Features

  • Capacitance & Voltage — 220 µF nominal capacitance at a rated voltage of 16 V; polarization as an electrolytic capacitor.
  • Wide Operating Temperature — Rated for −55 °C to +105 °C to support operation across broad temperature extremes.
  • High-temperature Reflow Compatibility — Corresponds with 260 °C peak reflow soldering; recommended reflow condition: 260 °C peak for 5 seconds, and 230 °C over 60 seconds twice (specific leaded sizes: φ8 × 6.2, φ10 × 10: one time).
  • AEC‑Q200 Qualified — Supplied as an AEC‑Q200 qualified part, aligning the component with automotive stress testing requirements.
  • Surface-mount Chip Package — Radial, can-style SMD chip case designed for automated mounting; nominal footprint size L: 7.7 × D: 6.3 mm with surface-mount land size L: 6.6 × W: 6.6 mm.
  • Endurance at Elevated Temperature — Rated for 1000 hours at 105 °C with defined limits on capacitance change, tan δ, and leakage current.
  • Ripple Current Performance — Specified ripple current: 105 mA at 120 Hz and 157.5 mA at 100 kHz, useful for evaluating AC stress in power applications.
  • Tolerance & Leakage — Capacitance tolerance ±20% and leakage current specification per series: after 2 minutes’ application of rated voltage at 20 °C, leakage current ≤ 0.01CV or 3 µA (whichever is greater).
  • RoHS Compliant — Conforms to the RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

  • Automotive Electronics — Suited for use in vehicle electronic modules where wide ambient temperature range and AEC‑Q200 qualification are required for reliable operation.
  • Control Modules and Power Systems — Designed for surface-mount implementation in power-supply and control circuits that require durable capacitive energy storage and high-temperature reflow compatibility.
  • SMT Assembly Lines — Carrier-tape feedability and compatibility with 260 °C peak reflow make this part suitable for automated PCB assembly processes in high-volume production.

Unique Advantages

  • High-temperature reflow readiness: Supports 260 °C peak reflow, allowing integration into modern SMT assembly flows without special handling.
  • Automotive-grade qualification: AEC‑Q200 status provides a clear qualification path for automotive system designers requiring parts that meet industry stress tests.
  • Wide operating temperature window: −55 °C to +105 °C rating ensures functionality across extreme ambient conditions encountered in vehicle environments.
  • Compact chip package: Small L: 7.7 × D: 6.3 mm footprint and SMD can format reduce board space while remaining compatible with automated placement.
  • Specified endurance at elevated temperature: 1000 hours at 105 °C endurance rating helps designers size components for long-term thermal stress resilience.
  • Measurable ripple performance: Defined ripple current values at 120 Hz and 100 kHz aid in system-level thermal and lifetime calculations.

Why Choose UWZ1C221MCL1GS?

The UWZ1C221MCL1GS combines the UWZ series’ series-level characteristics with part-level specifications—220 µF at 16 V—into a compact, surface-mount aluminum electrolytic capacitor engineered for automotive environments. Its AEC‑Q200 qualification, wide temperature rating, and 260 °C reflow compatibility make it appropriate for designs that require reliable, SMT-ready bulk capacitance under thermal stress.

This part is suited to designers and manufacturers building automotive electronic modules and other systems that demand verified endurance, carrier-tape compatibility for automated assembly, and traceable performance data for lifecycle planning.

Request a quote or submit a pricing inquiry to discuss availability, lead times, and integration details for the UWZ1C221MCL1GS.

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    Date Founded: 1950


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