UWZ1E101MCL1GS

The UWZ1E101MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount assembly and applications that demand wide operating temperature and industry-grade reliability. It provides 100 µF capacitance at a 25 V rating in a compact radial can SMD package, optimized for automated mounting and high-temperature reflow processes.

Engineered for automotive and other high-reliability markets, this part combines AEC‑Q200 qualification, RoHS compliance, and endurance specifications that support sustained operation up to 105°C with defined lifetime and ripple performance.

Key Features

• Capacitance & Voltage — 100 µF nominal capacitance with a 25 V rated voltage and ±20% tolerance for bulk energy storage and decoupling on DC rails.
• Chip-Type SMD Package — Radial, can-style surface-mount package sized L: 7.7 × D: 6.3 mm with recommended land size 6.6 × 6.6 mm for automated placement.
• Wide Temperature Range — Operating range from –55°C to +105°C to support assemblies exposed to broad thermal environments.
• High-Temperature Reflow Compatible — Rated for 260°C peak reflow; recommended reflow condition includes a 260°C peak for 5 seconds (per manufacturer guidance) to accommodate modern SMT processes.
• Automotive-Grade Reliability — AEC‑Q200 qualified and specified for 1000 hours at 105°C endurance with defined limits on capacitance change, tan δ, and leakage current.
• Ripple and Leakage Characteristics — Ripple current ratings of 91 mA (120 Hz) and 136.5 mA (10 kHz) and a leakage-current limit of 0.01CV or 3 µA (whichever is greater) after standard test conditions.
• Regulatory Compliance — RoHS compliant in accordance with applicable directives.

Typical Applications

• Automotive Electronic Modules — Filter and decoupling capacitor for vehicle control units and power modules that require AEC‑Q200 qualified SMD components.
• Surface-Mount Power Supplies — Bulk energy storage and ripple suppression on SMD power rails where reflow compatibility and compact footprint are required.
• High-Temperature Assemblies — Components for boards processed with high-temperature reflow profiles or used in environments up to 105°C.

Unique Advantages

• AEC‑Q200 Qualification: Provides a known baseline for automotive-grade reliability and design-in confidence for safety- and performance-sensitive applications.
• 260°C Reflow Compatibility: Enables integration into modern SMT production flows that require high peak reflow temperatures without compromising capacitor characteristics.
• Wide Operating Temperature: –55°C to +105°C rating supports electronics exposed to extreme ambient conditions.
• Defined Endurance: 1000 hours at 105°C with specified limits on capacitance, tan δ, and leakage current for predictable long-term behavior.
• Compact SMD Can Form Factor: Small footprint (7.7 × 6.3 mm) and standardized land pattern simplify layout for automated assembly and dense board designs.
• Measured Ripple Performance: Published ripple current values at 120 Hz and 10 kHz help with thermal and lifetime planning in power systems.

Why Choose UWZ1E101MCL1GS?

The UWZ1E101MCL1GS balances compact SMD packaging with automotive-grade reliability, making it a practical choice for designers needing a 100 µF, 25 V aluminum electrolytic capacitor that withstands wide temperature swings and high-temperature reflow. Its AEC‑Q200 qualification, defined endurance at 105°C, and RoHS compliance make it well suited for production in regulated markets.

This part is ideal for engineers specifying capacitors for automotive electronic modules and other applications that require reflow-compatible SMD components with verifiable ripple, leakage, and lifetime characteristics backed by Nichicon's product specification.

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