UWZ1E330MCL1GB

The UWZ1E330MCL1GB is a chip-style aluminum electrolytic capacitor designed for surface-mount assembly and automotive use. It delivers 33 µF at 25 V in a compact radial can SMD package, with rated operation across a wide temperature range from −55°C to +105°C.

Key value propositions include compatibility with 260°C peak reflow processes, AEC‑Q200 qualification for automotive applications, and 1,000 hours endurance at 105°C—making it suitable for designs that require high-temperature reflow assembly and verified high-temperature reliability.

Key Features

• Electrical — 33 µF capacitance at a 25 V rated voltage with polarity (polarized capacitor) and ±20% tolerance, suitable for energy storage and decoupling within its rated voltage and capacitance.
• Wide temperature range — Rated for −55°C to +105°C operation, supporting use in environments with large temperature excursions.
• High-temperature reflow compatibility — Engineered for 260°C peak reflow soldering. Recommended reflow condition: 260°C peak for 5 seconds; 230°C over 60 seconds, repeatable per datasheet guidance.
• Automotive-qualified — AEC‑Q200 qualified, aligning the part with automotive component qualification requirements specified in the product data.
• Reliability and lifetime — Endurance specified as 1,000 hours at 105°C with defined limits for capacitance change, tan δ and leakage current after test.
• Package and mounting — Chip type radial can SMD with footprint land size L: 6.6 × W: 6.6 mm and component size L: 5.4 × D: 6.3 mm, suitable for automated mounting from carrier tape.
• Regulatory — RoHS compliant per the directive noted in the product data.

Typical Applications

• Automotive electronic control units (ECUs) — Provides bulk decoupling and energy storage in modules requiring AEC‑Q200 qualified components and operation from −55°C to +105°C.
• Power conditioning and filtering — 33 µF at 25 V with specified ripple current values supports smoothing and filtering in power-supply sections where space is constrained and high-temperature soldering is used.
• On-board modules requiring high-temperature assembly — Compatible with 260°C peak reflow processes, enabling integration into assemblies that undergo high-temperature soldering profiles.

Unique Advantages

• 260°C reflow compatibility: Supports high-temperature reflow profiles (260°C peak) per recommended conditions, enabling use in assemblies with high-temperature process steps.
• AEC‑Q200 qualification: Meets the automotive component qualification stated in the product data, supporting designs that require qualified parts.
• Wide operating temperature: −55°C to +105°C rating ensures the capacitor maintains functionality across demanding environmental ranges.
• Proven high-temperature endurance: Specified for 1,000 hours at 105°C with defined acceptance criteria for capacitance, tan δ and leakage current.
• Compact SMD radial-can package: Small footprint (L: 5.4 × D: 6.3 mm) with a recommended land size (6.6 × 6.6 mm) that supports automated placement from carrier tape.
• Compliance-ready: RoHS compliance supports regulatory requirements for restricted substances as noted in the product data.

Why Choose UWZ1E330MCL1GB?

UWZ1E330MCL1GB combines a compact SMD radial-can form factor with automotive-grade qualification and high-temperature assembly compatibility, making it a practical choice for engineers building modules destined for harsh environments or requiring high-temperature reflow. Its electrical rating (33 µF, 25 V), wide operating temperature, and endurance specification provide quantifiable performance characteristics to support design decisions.

This part is well suited for teams working on automotive electronics and other applications where verified high-temperature performance, long-term endurance at elevated temperatures, and automated assembly compatibility are required.

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