UWZ1E331MCL1GS

The UWZ1E331MCL1GS is a surface-mount aluminum electrolytic capacitor in the Nichicon UWZ series, offering 330 µF capacitance at a 25 V rating. Designed as a chip-type SMD can (φ10 × 10L), it targets assemblies that require wide temperature operation, reliable ripple handling and automated placement with embossed carrier taping.

Key value propositions include wide operating temperature (−55°C to 105°C), AEC-Q200 qualification for automotive use, and compatibility with high-temperature reflow processes for robust manufacturing integration.

Key Features

• Capacitance & Voltage — 330 µF nominal capacitance with a rated voltage of 25 V and tolerance of −20% to +20%.
• Wide Temperature Range — Specified operation from −55°C to +105°C to support demanding thermal environments.
• High-Temperature Reflow Compatibility — Chip-type construction compatible with 260°C peak reflow soldering as specified for the UWZ series, enabling automated assembly processes.
• AEC-Q200 Qualified — Meets AEC-Q200 qualification as indicated in the product data, suitable for automotive electronics applications.
• Endurance & Reliability — Rated for 1000 hours at 105°C with defined limits on capacitance change, tan δ and leakage current after endurance testing.
• Ripple Current Performance — Low-frequency ripple current of 190 mA at 120 Hz and high-frequency ripple current of 285 mA at 10 kHz, supporting filtering duties in power circuits.
• Leakage & Dissipation — Specified leakage current of 82.5 µA and tan δ (DF) of 0.16 measured at 20°C, 120 Hz for the 25 V rating.
• Compact SMD Package — φ10 × 10L can-style SMD package with surface-mount land size approximately 1.03 × 1.03 cm and embossed carrier taping for automated placement.
• RoHS Compliant — Meets RoHS directive requirements for materials compliance.

Typical Applications

• Automotive Electronics — Suited for use in automotive systems where AEC-Q200 qualification and wide temperature operation (−55°C to +105°C) are required.
• Board-Level Power Modules — Compact SMD can for power filtering and smoothing in compact assemblies that undergo high-temperature reflow processing.
• Industrial Electronics — Applications requiring long endurance at elevated temperatures (1000 h at 105°C) and reliable ripple handling across low and high frequencies.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q200 qualification supports use in automotive and similarly demanding applications requiring recognized component reliability.
• Wide Operational Temperature: −55°C to +105°C rating allows deployment across harsh thermal environments without derating outside specified limits.
• Manufacturing-Friendly Package: Embossed carrier taping plus 260°C peak reflow capability streamlines automated placement and soldering workflows.
• Robust Endurance: 1000 hours at 105°C endurance rating with controlled limits on capacitance, tan δ and leakage current ensures predictable long-term performance.
• Effective Ripple Handling: Specified ripple currents at 120 Hz and 10 kHz provide explicit performance figures for designers balancing low- and high-frequency filtering needs.
• Regulatory Compliance: RoHS compliance simplifies integration into regulated product lines and supply chains.

Why Choose UWZ1E331MCL1GS?

The UWZ1E331MCL1GS combines a compact chip-type SMD can with clearly specified electrical and environmental performance: 330 µF at 25 V, verified ripple current capability, low-temperature to high-temperature operation (−55°C to +105°C), and 1000 h endurance at 105°C. Its AEC-Q200 qualification and RoHS compliance position it for demanding applications that require traceable reliability and materials conformity.

This part is suited to engineers designing automotive or industrial power and filtering subsystems who need a robust, reflow-capable SMD electrolytic solution that integrates into automated assembly processes and provides defined long-term performance characteristics.

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