UWZ1C681MCL1GS

The UWZ1C681MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon’s UWZ series, designed for surface-mount assembly and automated carrier-tape feeding. It delivers 680 µF at 16 V in a compact radial can SMD package with a wide operating temperature range of –55°C to +105°C.

Targeted for demanding environments, this part supports 260°C peak reflow soldering and carries AEC-Q200 qualification and RoHS compliance, making it suitable for automotive and other applications that require high-temperature assembly and extended endurance.

Key Features

• Capacitance & Voltage: 680 µF rated capacitance at 16 V with ±20% tolerance (120 Hz, 20°C).
• Wide Operating Temperature: Specified operation from –55°C to +105°C for broad thermal margins in harsh environments.
• High-temperature Reflow Compatible: Corresponds with 260°C peak reflow soldering; recommended reflow condition includes a 260°C peak for 5 seconds and 230°C over 60 seconds (repeat cycles per datasheet guidance).
• AEC-Q200 Qualified: AEC-Q200 qualification and RoHS compliance for regulated and automotive-focused designs.
• Endurance: Rated for 1000 hours at 105°C with specified limits on capacitance change, tan δ, and leakage current after recovery to 20°C.
• Leakage Current Specification: After 2 minutes’ application of rated voltage at 20°C, leakage current is not more than 0.01CV or 3 µA, whichever is greater.
• Ripple Current Capability: 310 mA at 120 Hz and 465 mA at 10 kHz to support smoothing and decoupling duties across frequency ranges.
• Compact SMD Can Package: Radial can SMD footprint with physical size approximately 1.0 cm × 1.0 cm and recommended land size 1.03 cm × 1.03 cm; compatible with automatic mounting machines fed by carrier tape.
• Polarized Design: Polar aluminum electrolytic construction for DC filtering and energy storage on power rails.

Typical Applications

• Automotive electronics: AEC-Q200 qualification and –55°C to +105°C operation make this capacitor suitable for automotive control modules and systems that require regulated component qualification.
• Surface-mount power assemblies: Chip-type SMD format and carrier-tape compatibility enable efficient automated mounting on power supply and control PCBs.
• High-temperature assembly processes: Designed for boards that undergo 260°C peak reflow, enabling use with modern lead-free SMT production flows.

Unique Advantages

• High capacitance in a compact footprint: 680 µF available in a ~1.0 cm × 1.0 cm radial can SMD package reduces board area while providing bulk capacitance.
• Designed for automotive-grade reliability: AEC-Q200 qualification and endurance rated at 1000 hours at 105°C support long-term performance in regulated applications.
• Assembly-ready for lead-free processes: Compatibility with 260°C peak reflow simplifies integration into RoHS-compliant, lead-free SMT production.
• Broad frequency ripple handling: Specified ripple currents at 120 Hz and 10 kHz accommodate both low- and high-frequency smoothing needs.
• Measured leakage and loss characteristics: Defined leakage current limits and tan δ specifications provide predictable behavior for power and timing circuits.

Why Choose UWZ1C681MCL1GS?

The UWZ1C681MCL1GS balances high capacitance and proven reliability in a surface-mount radial can designed for automated assembly and high-temperature reflow. With AEC-Q200 qualification, RoHS compliance, and a wide –55°C to +105°C operating range, it addresses the needs of automotive and other demanding embedded systems that require robust, predictable DC storage and smoothing.

This capacitor is well suited for engineers specifying components for regulated environments and production flows that demand high-temperature soldering compatibility and defined endurance metrics. Choosing Nichicon’s UWZ1C681MCL1GS helps simplify BOM decisions where compact bulk capacitance, ripple handling, and qualification are key considerations.

Request a quote or contact sales to discuss availability, pricing, and how UWZ1C681MCL1GS can fit your next design.