UZT1C220MCL1GB

The UZT1C220MCL1GB is a chip‑type aluminum electrolytic capacitor from Nichicon's UZT series, rated 22 µF at 16 V. It is designed for surface mounting on high‑density PC boards and is compatible with automatic mounting equipment fed by carrier tape.

Engineered for demanding environments, this capacitor supports a wide operating temperature range of –40 °C to +105 °C and carries AEC‑Q200 qualification, making it suitable for automotive and other reliability‑focused applications.

Key Features

• Package & Mounting Low‑profile chip type designed for surface mounting on high‑density PC boards; package case described as radial, can ‑ SMD and carrier‑tape compatible for automated assembly.
• Electrical Characteristics 22 µF nominal capacitance at 16 V with ±20% tolerance; polarized aluminum electrolytic construction.
• Temperature & Reliability Rated for –40 °C to +105 °C operation and specified for 1000 hours at 105 °C with endurance limits (capacitance change within ±25% for 16 V or less).
• Ripple & Frequency Performance Specified ripple current: 26 mA at 120 Hz and 39 mA at 10 kHz; frequency coefficients available for other frequencies (e.g., 0.70 at 50 Hz, 1.50 at 10 kHz or more).
• Leakage and Loss Leakage current after 2 minutes at 20 °C is not more than 0.01CV or 3 µA (whichever is greater); tangent of loss angle (tan δ) for 16 V is specified at 0.20 (max) measured at 120 Hz, 20 °C.
• Dimensions & Land Pattern Compact footprint with body dimensions L: 4.5 × D: 5 mm and recommended surface‑mount land size L: 5.3 × W: 5.3 mm.
• Standards & Compliance AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronics — Suited for automotive modules where AEC‑Q200 qualification and operation to +105 °C are required.
• High‑density surface‑mount assemblies — Chip form factor and compact footprint enable board space savings on densely populated PCBs.
• Automated production — Compatible with carrier‑tape feeding for automatic mounting machines, supporting high‑volume assembly.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q200 rating delivers verified reliability for automotive and similarly demanding system designs.
• Wide operating temperature span: –40 °C to +105 °C range supports applications exposed to harsh thermal conditions.
• Short, low‑profile SMD form: Chip design with a compact 4.5 × 5 mm body helps minimize board height while supporting high‑density layouts.
• Manufacturing‑ready: Carrier‑tape compatibility enables efficient placement with automated assembly equipment.
• Proven endurance: Rated for 1000 hours at 105 °C with defined limits on capacitance change, tan δ and leakage current.
• Measurable ripple performance: Defined ripple current ratings at 120 Hz and 10 kHz with published frequency coefficients for design accuracy.

Why Choose UZT1C220MCL1GB?

UZT1C220MCL1GB combines a compact chip package, automotive‑grade qualification, and wide temperature tolerance to meet the needs of reliability‑oriented surface‑mount designs. Its electrical and mechanical specifications—22 µF at 16 V, defined leakage and tan δ limits, and endurance at 105 °C—provide predictable performance for engineers specifying capacitors for challenging environments.

This part is appropriate for designers seeking a space‑efficient aluminum electrolytic SMD solution for automotive or high‑density assemblies that require AEC‑Q200 verification, RoHS compliance, and production‑friendly tape feeding.

Request a quote or submit an inquiry for UZT1C220MCL1GB to discuss ordering, availability, and application support.