UZT1C330MCL1GB

The UZT1C330MCL1GB is a chip‑type aluminum electrolytic capacitor in a compact surface‑mount can designed for high‑density PCBs. With a rated capacitance of 33 µF at 16 V, polarized construction and a low profile, it targets designs that require reliable smoothing and decoupling across a wide temperature range.

This part is AEC‑Q200 qualified, RoHS compliant and specified for operation from –40 °C to +105 °C, offering a combination of automotive‑grade qualification and compact packaging suitable for automated surface‑mount assembly.

Key Features

• Package & Mounting — Chip type radial can in an SMD form factor sized L: 4.5 × D: 6.3 mm and compatible with carrier‑tape fed automatic mounting machines for high‑density PCB assembly.
• Electrical — 33 µF capacitance at 16 V rated voltage with ±20% tolerance; polarized construction for standard electrolytic smoothing and decoupling applications.
• Temperature Range — Rated for operation from –40 °C to +105 °C to address wide ambient and under‑hood temperature conditions.
• Reliability & Endurance — Specified endurance of 1000 hours at 105 °C; for 16 V and lower parts, capacitance change is within ±25% after the endurance test.
• Leakage Current — Series specification: after 2 minutes at rated voltage and 20 °C, leakage current is not more than 0.01CV or 3 µA, whichever is greater.
• Ripple Current & Frequency Performance — Ripple current specified as 35 mA at 120 Hz and 52.5 mA at 10 kHz; frequency coefficient increases with frequency (e.g., 1.00 at 120 Hz, 1.50 at 10 kHz or more).
• Compliance & Qualification — AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), supporting regulated manufacturing and automotive use cases.

Typical Applications

• Automotive electronics — AEC‑Q200 qualification and –40 °C to +105 °C range make this capacitor suitable for automotive modules that require electrolytic filtering and decoupling under varying temperatures.
• High‑density PCB assemblies — Compact chip‑type SMD can and compatibility with carrier‑tape automated placement support space‑constrained board layouts.
• Automated surface‑mount production — Designed for automatic mounting machines fed with carrier tape, simplifying pick‑and‑place assembly flows.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q200 qualification supports use in vehicle electronics where component qualification is required.
• Wide operating temperature: –40 °C to +105 °C rating enables stable performance across harsh ambient and thermal environments.
• Low‑profile chip form factor: Compact L: 4.5 × D: 6.3 mm can‑style SMD design saves board space on high‑density PCBs.
• Endurance at elevated temperature: 1000 hours at 105 °C with defined limits (capacitance change within ±25% for 16 V or less) provides predictable long‑term behavior.
• Defined ripple and frequency behavior: Published ripple current values and frequency coefficients allow designers to size capacitors against real operating conditions.
• RoHS compliant: Conforms to RoHS directives for regulated markets and assembly processes.

Why Choose UZT1C330MCL1GB?

The UZT1C330MCL1GB combines a compact chip‑type SMD can with automotive‑grade qualification and clear endurance and leakage specifications, making it a practical choice for engineers specifying electrolytic decoupling or smoothing in temperature‑challenging and space‑constrained assemblies. Its defined ripple current performance and frequency coefficients simplify selection for AC and switching applications.

This part is well suited to teams building robust electronic modules that require predictable long‑term behavior (1000 hours at 105 °C), automated placement compatibility, and compliance with RoHS and AEC‑Q200 requirements.

To request a quote or submit a procurement inquiry for UZT1C330MCL1GB, please contact the vendor sales channel or submit a parts request referencing the full part number and required quantities.