UZT1E330MCL1GB

CAP ALUM 33UF ±20% 25V SMD
Part Description

33 µF 25 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 552 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUZT
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance33 µFECCNEAR99
ESRN/AHeight Seated (Max)4.6 mmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp1000 h @ 105°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40°C - 105°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency63 mA @ 10 kHzRipple Current Low Frequency42 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension4.5 x 6.3 mmSurface Mount Land Size6.6 x 6.6 mm
Tolerance-20%~20%Voltage25 V

Overview of UZT1E330MCL1GB – 33 µF, 25 V, 4.5 mm SMD Aluminum Electrolytic Capacitor

The UZT1E330MCL1GB is a Nichicon UZT series chip-type aluminum electrolytic capacitor specified at 33 µF and 25 V in a compact surface-mount can package. It is designed for high-density PCBs and automatic tape-fed mounting, offering a low-profile solution for board-level power components.

With a wide operating temperature range of –40 to 105°C, AEC‑Q200 qualification, and RoHS compliance, this part addresses reliability and regulatory requirements for automotive and industrial electronics applications that require rugged, compact capacitance.

Key Features

  • Electrical Rating: 33 µF capacitance at a rated voltage of 25 V with ±20% tolerance, providing defined energy storage for board-level power needs.
  • Compact SMD Can Package: Chip-type radial can (SMD) measuring L: 4.5 × D: 6.3 mm with a surface-mount land size of 6.6 × 6.6 mm, optimized for high-density PCB layouts.
  • Low Profile: 4.5 mm seated height suitable for space-constrained assemblies where vertical clearance is limited.
  • Wide Temperature Range: Rated for operation from –40°C to +105°C to support harsh-environment electronics.
  • Reliability & Lifetime: Endurance rated at 1000 hours at 105°C, with specified limits for capacitance change, tan δ and leakage current after the endurance test.
  • Ripple Performance: Specified ripple current of 42 mA at 120 Hz and 63 mA at 10 kHz with published frequency coefficients for ripple current scaling (e.g., 1.00 at 120 Hz, 1.50 at 10 kHz or more).
  • Leakage Specification: Leakage current after 2 minutes at 20°C is not more than 0.01CV or 3 µA (whichever is greater), following the series specification.
  • Automotive Qualification & Compliance: AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), addressing automotive-grade reliability and environmental requirements.
  • Assembly Compatibility: Designed for surface mounting on high-density PCBs and is applicable to automatic mounting machines fed with carrier tape.

Typical Applications

  • Automotive Electronics: Suitable for automotive control modules and electronics that require AEC‑Q200 qualified, compact SMD capacitance across a wide temperature range.
  • High-density PCB Power Management: Used where board area and height are constrained and a SMD aluminum electrolytic capacitor is required for bulk decoupling or smoothing.
  • Industrial and Harsh-environment Electronics: Applicable to industrial control and telematics modules that demand operation from –40°C to +105°C and defined endurance at elevated temperature.
  • Automated Assembly Lines: Designed for compatibility with tape-fed automatic mounting for efficient, high-volume production.

Unique Advantages

  • Compact, Low-profile Footprint: 4.5 mm seated height and small L×D dimensions enable use in space-constrained designs without sacrificing capacitance.
  • Automotive-grade Reliability: AEC‑Q200 qualification and 1000-hour endurance at 105°C provide a predictable qualification baseline for automotive and industrial applications.
  • Wide Operating Temperature: –40°C to +105°C rating supports deployment in temperature-extreme environments common to automotive and industrial systems.
  • Assembly-friendly Design: Tape-fed, surface-mount chip form factor simplifies placement in automated SMT workflows and reduces manual handling.
  • Measurable Ripple Handling: Published ripple current values and frequency coefficients let designers size the capacitor to expected ripple conditions across frequency.
  • Regulatory Compliance: RoHS conformity reduces environmental compliance overhead in regulated markets.

Why Choose UZT1E330MCL1GB?

UZT1E330MCL1GB positions itself as a compact, assembly-friendly aluminum electrolytic capacitor for designers who need verified performance across a broad temperature range and AEC‑Q200 qualification. Its defined ripple specifications, endurance rating at 105°C, and tape-fed SMD form factor make it suitable for automotive and industrial applications where board density, reliability and automated production are priorities.

Built by Nichicon and following the UZT series specifications, this part offers a verifiable combination of size, electrical rating and environmental qualifications for engineers specifying durable, compact capacitance on modern PCBs.

If you would like pricing or availability information for UZT1E330MCL1GB, please request a quote or contact sales to submit your requirements and receive a tailored response.

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    Date Founded: 1950


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