UZT1H100MCL1GB

The UZT1H100MCL1GB is a 10 µF, 50 V aluminum electrolytic chip capacitor in a low-profile surface-mount can designed for high-density PCB assemblies. It combines a compact 4.5 mm height and a 6.3 mm diameter footprint with features targeted at automated SMT production and demanding temperature environments.

Engineered for applications requiring robust environmental performance, this capacitor is RoHS compliant and AEC-Q200 qualified, and it is specified to operate across a wide temperature range from −40°C to +105°C with a rated lifetime of 1000 hours at 105°C.

Key Features

• Electrical Performance — 10 µF capacitance at 50 V rated voltage with polarization and a tolerance of ±20% (−20% to +20%).
• Low-Profile SMD Package — Chip-type radial can SMD with overall dimensions L: 4.5 × D: 6.3 mm, optimized for space-constrained designs.
• Surface-Mount Compatibility — Designed for surface mounting on high-density PC boards and applicable to automatic mounting machines fed with carrier tape.
• Wide Temperature Range — Category temperature range from −40°C to +105°C for reliable operation in varied environments.
• Reliability & Lifetime — Endurance specification: 1000 hours at 105°C with defined limits for capacitance change, tan δ and leakage current.
• Ripple Current Capability — Specified ripple currents of 26 mA at 120 Hz and 39 mA at 10 kHz; frequency coefficients available for other operating frequencies.
• Compliance & Qualification — RoHS compliant and AEC-Q200 qualified, suitable for qualification-requiring applications.
• PCB Land Pattern — Recommended surface mount land size L: 6.6 × W: 6.6 mm to aid layout and assembly.

Typical Applications

• Automotive Electronics — AEC-Q200 qualification and wide temperature range make it suitable for vehicle electronic modules requiring compact electrolytic capacitance.
• High-Density PC Boards — Low-profile chip form factor and SMD compatibility enable use in space-constrained, densely populated board designs.
• Automated Assembly — Designed for carrier-tape feed to automatic mounting machines, easing integration into high-volume manufacturing.

Unique Advantages

• Compact, Low-Profile Design: 4.5 mm height and small diameter reduce board real estate while providing electrolytic capacitance where axial or larger cans are impractical.
• Automated Production Ready: Compatible with carrier-tape fed mounting, streamlining pick-and-place processes for volume assembly.
• Temperature and Endurance Specified: Rated for −40°C to +105°C and 1000 hours at 105°C, offering predictable behavior in thermal stress conditions.
• Industry Qualification: AEC-Q200 qualification and RoHS compliance provide traceable credentials for regulated and reliability-focused designs.
• Clear PCB Land Guidance: Provided land size (6.6 × 6.6 mm) simplifies layout optimization and helps ensure reliable solder joints.

Why Choose UZT1H100MCL1GB?

The UZT1H100MCL1GB is positioned for designers who need a compact, surface-mount aluminum electrolytic capacitor with defined high-temperature endurance and automotive-grade qualification. Its combination of low profile, SMT-ready packaging, and specified ripple/current and temperature performance makes it suitable for dense electronic modules and environments requiring robust thermal performance.

This part is well suited to engineers specifying components for applications that demand predictable endurance and qualification credentials while minimizing board space and supporting automated assembly processes.

If you would like pricing or availability information, request a quote or submit an inquiry to the sales team to receive detailed ordering and lead-time assistance.