UZT1H3R3MCL1GB

The UZT1H3R3MCL1GB is a Nichicon UZT-series aluminum electrolytic chip capacitor configured for surface-mount applications. It provides 3.3 μF capacitance at a 50 V rating in a compact chip-style, low-profile package designed for high-density printed circuit boards.

Engineered for robust operation across a wide temperature range (–40 °C to +105 °C) and AEC-Q200 qualified, this capacitor targets automotive and demanding industrial electronics that require reliable, board-level energy storage and filtering under elevated temperatures. It is RoHS compliant and suitable for automated SMT assembly.

Key Features

• Capacitance & Voltage — 3.3 μF rated capacitance at 50 V, with tolerance ±20% (–20% to +20%).
• Compact Chip Package — Chip-type aluminum electrolytic in a radial can SMD package; nominal dimensions L: 4.5 × D: 4 mm and surface-mount land size L: 4.3 × W: 4.3 mm.
• Low Profile — Designed with a 4.5 mm seated height for high-density board layouts.
• Wide Temperature Range — Rated for operation from –40 °C to +105 °C for deployment in thermally demanding environments.
• Reliability & Lifetime — Endurance specified as 1000 hours at 105 °C; represents lifecycle performance under rated conditions.
• Ripple Performance — Specified ripple: 12 mA at 120 Hz and 18 mA at 10 kHz with frequency-dependent coefficients provided in the datasheet.
• Leakage Current — After 2 minutes at rated voltage and 20 °C, leakage current is not more than 0.01CV or 3 μA, whichever is greater.
• Qualification & Compliance — AEC-Q200 qualified and RoHS compliant for regulated environments.
• Assembly Friendly — Designed for surface mounting on high-density PC boards and compatible with automated mounting via carrier tape.

Typical Applications

• Automotive Electronics — Suitable for automotive modules where AEC-Q200 qualification and wide temperature range are required.
• High-density PCB Assemblies — Chip form factor and low profile make it appropriate for space-constrained surface-mount designs.
• Automated SMT Production — Designed to be compatible with automatic mounting machines fed by carrier tape for efficient assembly.

Unique Advantages

• Compact energy storage: 3.3 μF in a small chip package supports designs that need board-level capacitance without large can capacitors.
• Wide operating temperature: –40 °C to +105 °C rating allows deployment in environments with broad thermal swings.
• AEC-Q200 qualified: Qualification provides documented suitability for automotive-grade applications and reliability expectations.
• SMT-ready design: Surface-mount package and supplied compatibility with carrier-tape mounting streamline automated assembly.
• Verified endurance: 1000-hour endurance at 105 °C gives a clear specification for lifetime planning under elevated-temperature operating conditions.
• Regulatory compliance: RoHS compliance supports use in regulated supply chains and markets.

Why Choose UZT1H3R3MCL1GB?

The UZT1H3R3MCL1GB combines a compact, low-profile chip package with a 3.3 μF / 50 V electrical rating and specifications targeted for demanding thermal and reliability requirements. Its AEC-Q200 qualification, RoHS compliance, and documented endurance at 105 °C position it for automotive and industrial projects that require durable, board-level electrolytic capacitance.

This capacitor is well suited for engineers specifying components for high-density surface-mount PCBs and automated assembly lines who need verifiable performance data—leakage, ripple, lifetime, and temperature limits—to support design and qualification activities.

If you would like pricing, availability, or to request a quote for UZT1H3R3MCL1GB, please submit a request or contact sales with your project requirements and volume needs.