UZT1H2R2MCL1GB

The UZT1H2R2MCL1GB is a chip-type aluminum electrolytic capacitor in a compact 4.5 mm height package designed for surface mounting on high-density printed circuit boards. It delivers 2.2 µF capacitance at a 50 V rating and is engineered for wide temperature operation from –40°C to +105°C.

Built for automated assembly and long-term reliability, this part is RoHS compliant and AEC-Q200 qualified, making it suitable for demanding electronics applications where space, temperature range and qualification matter.

Key Features

• Capacitance & Voltage — 2.2 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance (–20%~20%).
• Compact Chip Package — Chip-type, surface-mount radial can (SMD) with dimensions 4.5 × 4.0 mm to save board space on high-density PCBs.
• Wide Temperature Range — Operating temperature from –40°C to +105°C for use across broad environmental conditions.
• Automated Assembly Compatible — Designed for surface mounting and applicable to automatic mounting machines fed with carrier tape.
• AEC-Q200 Qualified & RoHS Compliant — Series-level AEC-Q200 qualification and compliance with RoHS directive (2011/65/EU, (EU)2015/863).
• Endurance — Rated for 1000 hours at 105°C; after the endurance test the capacitance change is within ±20% for rated voltages 25 V or more.
• Leakage & Loss Characteristics — Leakage current: after 2 minutes at rated voltage and 20°C, not more than 0.01CV or 3 µA (whichever is greater). Tangent of loss angle (tan δ) at 50 V: 0.14 (max) measured at 120 Hz, 20°C.
• Ripple Current & Frequency Coefficients — Specified ripple current of 9.6 mA at 120 Hz and 14.4 mA at 10 kHz; frequency coefficient information available for designing across frequencies.
• Recommended Land Pattern — Surface mount land size: 4.3 × 4.3 mm for PCB layout planning.

Typical Applications

• Automotive Electronics — Suitable for electronic modules where AEC-Q200 qualification is required and wide temperature performance is necessary.
• High‑Density PCB Assemblies — Compact chip package enables use in space-constrained board designs that require surface-mounted electrolytic capacitance.
• Automated SMT Production — Designed for compatibility with carrier-tape fed automatic mounting machines to streamline assembly and throughput.

Unique Advantages

• Space-saving chip form factor: 4.5 × 4.0 mm package minimizes board area for compact designs.
• Wide operating temperature: −40°C to +105°C supports applications exposed to broad thermal ranges.
• Qualification for automotive environments: AEC-Q200 qualification provides documented series-level reliability for automotive-grade designs.
• Designed for automated assembly: Carrier-tape compatibility reduces handling time and supports high-volume manufacturing.
• Validated endurance: 1000 hours at 105°C with defined capacitance and leakage limits offers predictable long-term behavior.
• Regulatory compliance: RoHS compliance supports environmental and regulatory requirements for modern electronics supply chains.

Why Choose UZT1H2R2MCL1GB?

UZT1H2R2MCL1GB positions itself as a compact, qualified electrolytic capacitor for designs that demand a small footprint, wide temperature range and assembly-line readiness. With a 2.2 µF / 50 V rating, AEC-Q200 qualification, RoHS compliance and defined endurance characteristics, it is a solid choice for engineers specifying capacitors for automotive and other harsh-environment electronics.

This part is well suited to teams focusing on reliable, repeatable manufacturing and long-term performance where space and temperature tolerance are key constraints. Its documented leakage, tan δ and ripple current values make it straightforward to evaluate in power-filtering and decoupling design contexts when those parameters are required.

If you would like pricing, availability or a formal quote for UZT1H2R2MCL1GB, please request a quote or contact sales to discuss quantities, lead times and sample availability.