UZT1H010MCL1GB
| Part Description |
1 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 898 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UZT |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 1 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 4.6 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 1000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 8.1 mA @ 10 kHz | Ripple Current Low Frequency | 5.4 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 4.5 x 4 mm | Surface Mount Land Size | 4.3 x 4.3 mm | ||
| Tolerance | -20%~20% | Voltage | 50 V |
Overview of UZT1H010MCL1GB – 1 µF, 50 V Aluminum Electrolytic SMD Chip Capacitor (AEC‑Q200)
The UZT1H010MCL1GB is a chip‑type aluminum electrolytic capacitor designed for surface mounting on high‑density PC boards. It delivers 1 µF capacitance at 50 V in a compact SMD radial/can package optimized for automated placement and carrier‑tape feeding.
Engineered for demanding environments, this part is AEC‑Q200 qualified and RoHS compliant, with an operating temperature range of –40 °C to +105 °C and established endurance at elevated temperature.
Key Features
- Electrical Performance — 1 µF nominal capacitance with ±20% tolerance; rated voltage 50 V and tan δ (max.) 0.14 at 50 V measured at 120 Hz and 20 °C.
- Leakage Current Specification — After 2 minutes' application of rated voltage at 20 °C, leakage current is specified as not more than 0.01CV or 3 μA, whichever is greater.
- Ripple Current & Frequency Behavior — Rated ripple current of 5.4 mA at 120 Hz and 8.1 mA at 10 kHz for this part; frequency coefficients provided (e.g., 1.00 at 120 Hz, 1.50 at 10 kHz or more) to scale ripple capability with frequency.
- Package & Mounting — Chip‑type radial/can SMD package sized L 4.5 × D 4 mm with recommended land size 4.3 × 4.3 mm; designed for surface mounting and compatibility with automatic mounting machines fed by carrier tape.
- Temperature & Reliability — Operating range −40 °C to +105 °C; endurance tested with rated voltage applied for 1000 hours at 105 °C. For ratings 25 V and above (including 50 V), capacitance change after endurance is within ±20% of initial value.
- Manufacturing Robustness — Resistance to soldering heat validated (hot plate at 250 °C for 30 seconds) with capacitance change within ±10% and no increase in leakage current beyond initial specified values.
- Compliance & Qualification — AEC‑Q200 qualified and compliant with RoHS directives (2011/65/EU, (EU)2015/863).
Typical Applications
- Automotive electronics — Suitable for use in automotive modules where AEC‑Q200 qualification and a −40 °C to +105 °C operating range are required.
- Power supply decoupling on high‑density PCBs — Compact chip package and SMD mounting optimize board area while providing bulk capacitance and ripple handling for local power stabilization.
- Automated SMT assembly — Designed for carrier‑tape feeding and automatic placement, simplifying high‑volume production workflows.
Unique Advantages
- AEC‑Q200 Qualification: Confidence for designs targeting automotive and similarly demanding markets requiring standardized component qualification.
- Wide operating temperature: −40 °C to +105 °C supports deployment across a broad range of ambient conditions.
- Compact SMD chip form factor: Small L 4.5 × D 4 mm footprint and recommended land pattern reduce PCB area usage on high‑density boards.
- High‑temperature endurance: 1000 hours at 105 °C with defined post‑test limits ensures predictable long‑term behavior under thermal stress.
- Manufacturing ready: Compatibility with automatic mounting machines and validated resistance to soldering heat streamline assembly and reflow processes.
- Clear electrical limits: Specified leakage current, tan δ, and ripple current figures allow straightforward design margining and verification.
Why Choose UZT1H010MCL1GB?
UZT1H010MCL1GB is positioned for engineers who need a compact, qualified aluminum electrolytic capacitor that integrates into automated surface‑mount processes while meeting elevated temperature and endurance requirements. Its combination of AEC‑Q200 qualification, RoHS compliance, and defined electrical and reliability specifications makes it suitable for professional designs where predictability and manufacturability matter.
This part is ideal for designs that require board‑space efficiency, standardized automotive qualification, and clear performance data for ripple, leakage, and long‑term endurance. Using a component with documented high‑temperature endurance and soldering robustness helps reduce rework risk and simplifies qualification in production environments.
If you would like pricing, availability, or a quotation for UZT1H010MCL1GB, please request a quote or contact sales to discuss your project requirements and lead times.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016