UZT1V4R7MCL1GB

The UZT1V4R7MCL1GB is a chip-type aluminum electrolytic capacitor in a compact surface-mount can, designed for high-density PCBs. It combines a 4.7 µF capacitance with a 35 V rating and a low-profile 4.5 mm height for space-constrained assemblies.

Engineered for reliability in elevated temperatures, this part operates across a wide temperature range (–40 to +105 °C), is AEC‑Q200 qualified, and is RoHS compliant—attributes that support demanding electronics applications and automated assembly processes.

Key Features

• Electrical — 4.7 µF nominal capacitance with a 35 V rated voltage and capacitance tolerance of ±20% (measured at 120 Hz, 20 °C). The device is polarized.
• Package & Mounting — Chip-type SMD aluminum can with overall dimensions L: 4.5 × D: 4 mm and recommended land size L: 4.3 × W: 4.3 mm; suitable for automatic mounting from carrier tape.
• Temperature & Reliability — Rated for operation between –40 and +105 °C and specified for 1000 hours at 105 °C with capacitance change within specified endurance limits for rated voltages ≥25 V.
• Ripple Performance — Rated ripple current of 13 mA at 120 Hz and 19.5 mA at 10 kHz; frequency coefficients provided (1.00 at 120 Hz, 1.50 at 10 kHz or more) to scale ripple ratings across frequency.
• Assembly Robustness — Meets resistance‑to‑soldering‑heat requirements (hot plate 30 s at 250 °C) with capacitance change within ±10% after reflow conditions described in the datasheet.
• Compliance & Qualification — AEC‑Q200 qualified and RoHS (2011/65/EU, (EU)2015/863) compliant.

Typical Applications

• Automotive Electronics — AEC‑Q200 qualification and a –40 to +105 °C rating make this capacitor suitable for automotive electronic assemblies that require validated components.
• High‑Density PCB Designs — Chip‑type SMD can and compact footprint support surface mounting on densely populated boards and automated carrier‑tape assembly.
• Power and Thermal Stress Environments — 35 V rating, 4.7 µF capacitance, and 1000 h endurance at 105 °C provide stable performance where elevated operating temperatures are expected.

Unique Advantages

• AEC‑Q200 Qualification: Provides documented qualification for designs that require automotive‑grade components.
• Wide Operating Temperature: –40 to +105 °C range supports use across a broad set of environmental conditions.
• Compact SMD Form Factor: 4.5 × 4.0 mm can size and 4.3 × 4.3 mm land recommendation enable space-saving layouts on high-density boards.
• High‑Temperature Endurance: Specified for 1000 hours at 105 °C with defined limits on capacitance change and leakage after test.
• Frequency‑Aware Ripple Ratings: Published ripple current values and frequency coefficients allow predictable performance scaling from 50 Hz up to 10 kHz and above.
• Assembly‑Friendly: Designed for automatic mounting from carrier tape and passes soldering‑heat resistance tests described in the datasheet.

Why Choose UZT1V4R7MCL1GB?

UZT1V4R7MCL1GB positions itself as a reliable, compact aluminum electrolytic solution for engineers needing a 4.7 µF, 35 V SMD capacitor that withstands elevated temperatures and automated assembly. Its AEC‑Q200 qualification, RoHS compliance, and defined endurance and soldering characteristics make it appropriate for designs where component qualification and thermal resilience are important.

This part is well suited to teams developing space‑constrained boards for automotive and industrial applications that require predictable ripple handling and long‑term performance at high ambient temperatures, while supporting automated PCB assembly processes.

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