UZT1A330MCL1GB

The UZT1A330MCL1GB is a chip‑type aluminum electrolytic capacitor in a low‑profile surface‑mount package engineered for high‑density PCBs and automated assembly. It delivers 33 µF at 10 V with a compact L: 4.5 × D: 5 mm footprint, a 4.5 mm case height and is suitable for automotive electronics requiring wide temperature operation and industry‑level qualification.

Key value propositions include AEC‑Q200 qualification, a –40 °C to +105 °C operating range, tape‑feed compatibility for pick‑and‑place assembly, and RoHS compliance for regulated designs.

Key Features

• Electrical Characteristics — 33 µF nominal capacitance at 10 V rated voltage with ±20% tolerance; polarized aluminum electrolytic construction.
• Package & Mounting — Chip type surface‑mount can (radial, can − SMD) sized L: 4.5 × D: 5 mm with recommended land size L: 5.3 × W: 5.3 mm for PCB layout.
• Temperature & Lifetime — Rated for operation from −40 °C to +105 °C with a specified lifetime of 1000 hours at 105 °C.
• Reliability & Qualification — AEC‑Q200 qualified for automotive electronics and designed to meet endurance and shelf‑life requirements per the series datasheet.
• Assembly Compatibility — Designed for surface mounting on high‑density PC boards and compatible with carrier‑tape automated placement.
• Ripple & Frequency Performance — Rated ripple current of 30 mA at 120 Hz and 45 mA at 10 kHz; frequency coefficient of rated ripple current increases at higher frequencies (series data).
• Environmental Compliance — RoHS compliant (2011/65/EU and (EU)2015/863).
• Leakage Current (series spec) — After 2 minutes’ application of rated voltage at 20 °C, leakage current limited to 0.01CV or 3 µA, whichever is greater (per series datasheet).

Typical Applications

• Automotive electronic modules — Use on control and sensor PCBs that require AEC‑Q200 qualified, wide‑temperature capacitors for power filtering and bulk capacitance.
• High‑density surface‑mount boards — Compact chip form factor suited to space‑constrained designs and automated tape‑fed assembly.
• Power rail decoupling in embedded systems — Low‑profile SMD capacitor for local energy storage on DC power rails where temperature stability and reliability are required.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q200 rating supports use in automotive electronics and other high‑reliability environments.
• Wide operating temperature: −40 °C to +105 °C specification maintains capacitance and performance across harsh thermal conditions.
• Compact SMD chip form: Small footprint (4.5 × 5 mm) and low profile simplify placement on high‑density PCBs and reduce board real estate.
• Assembly‑friendly packaging: Designed for carrier‑tape automated mounting to streamline high‑volume production workflows.
• Documented endurance: 1000 hours at 105 °C endurance rating provides a measurable reliability expectation for elevated‑temperature operation.
• Regulatory compliance: RoHS compliance supports deployment in regulated markets and helps streamline product approvals.

Why Choose UZT1A330MCL1GB?

The UZT1A330MCL1GB balances compact SMD packaging with automotive‑level qualification and defined high‑temperature endurance, making it well suited for designers building reliable, densely populated PCBs for automotive and industrial applications. Its tape‑feed compatibility and documented ripple, leakage, and endurance characteristics simplify integration into production and validation flows.

This capacitor is a clear option for engineers seeking a proven aluminum electrolytic in a small chip package that provides measurable performance across temperature and frequency, backed by series datasheet specifications from Nichicon.

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