UZT0J470MCL1GB

The UZT0J470MCL1GB is a chip-type aluminum electrolytic capacitor in a low-profile surface-mount package. It delivers 47 µF capacitance at a 6.3 V rating and is designed for high-density PC boards and automated assembly.

Key value propositions include a wide operating temperature range (–40 °C to +105 °C), AEC-Q200 qualification, and compatibility with carrier-tape fed automatic mounting machines—making it suitable for demanding, assembly-line production environments, including automotive electronics.

Key Features

• Capacitance & Voltage — 47 µF nominal capacitance with a rated voltage of 6.3 V and tolerance of ±20% (–20%~20%).
• Temperature Range — Rated for operation from –40 °C to +105 °C to support a wide range of environmental conditions.
• Package & Mounting — Chip-type radial can in an SMD package sized L: 4.5 × D: 5 mm with recommended land size 5.3 × 5.3 mm; designed for surface mounting on high-density PCBs and compatible with carrier-tape automatic placement.
• Automotive Qualification — AEC-Q200 Qualified, supporting use in automotive-grade designs where that qualification is required.
• Reliability & Endurance — Endurance rating of 1000 hours at 105 °C with specified limits for capacitance change, tan δ, and leakage current after endurance testing.
• Leakage & Loss — Leakage current specification: after 2 minutes’ application of rated voltage at 20 °C, leakage ≤ 0.01CV or 3 µA (whichever is greater). Tangent of loss angle (tan δ) at 120 Hz, 20 °C is max 0.38 for the 6.3 V rating.
• Ripple Current & Frequency Response — Specified ripple current: 32 mA at 120 Hz and 48 mA at 10 kHz; frequency coefficient of rated ripple current increases up to 1.50 at 10 kHz or more.
• Environmental Compliance — Compliant to the RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Component selection for automotive modules and control units where AEC-Q200 qualification is required.
• High-Density Surface-Mount PCBs — Decoupling and bulk capacitance on compact, densely populated boards enabled by the chip-type SMD package.
• Automated Assembly Lines — Designed for carrier-tape feeding and compatibility with automatic mounting machines to streamline production.

Unique Advantages

• AEC-Q200 Qualification: Provides confidence for designers targeting automotive and other demanding markets that require AEC-level qualification.
• Wide Operating Temperature: –40 °C to +105 °C rating supports designs exposed to harsh thermal environments.
• Low-Profile Chip Format: 4.5 mm height and compact 4.5 × 5 mm footprint enable space-efficient use on high-density PCBs.
• Assembly-Friendly: Carrier-tape compatibility and SMD packaging reduce handling and speed integration into automated manufacturing lines.
• Qualification-Proven Endurance: 1000 hours at 105 °C endurance specification with defined post-test limits for capacitance, tan δ, and leakage current.
• Measured Ripple and Loss Parameters: Published ripple current values at 120 Hz and 10 kHz and tan δ limits give predictable behavior for power-rail applications.

Why Choose UZT0J470MCL1GB?

The UZT0J470MCL1GB combines compact, low-profile SMD packaging with specifications tailored for production-scale, reliability-focused designs. With AEC-Q200 qualification, RoHS compliance, defined endurance at 105 °C, and compatibility with automated assembly, it is positioned for engineering teams building compact electronic modules—especially where automotive-grade qualification and predictable thermal performance are required.

This part is suitable for designers who need a small-footprint electrolytic capacitor with documented leakage, tan δ, and ripple current behavior, and who value components that integrate easily into automated manufacturing processes.

To request a quote or discuss volume pricing and availability, please submit a quote request or contact sales for more information.