UZT0J330MCL1GB

The UZT0J330MCL1GB is a chip-type aluminum electrolytic capacitor from Nichicon's UZT series, designed for surface-mount applications on high-density PC boards. It provides 33 µF capacitance at a 6.3 V rating in a compact, low-profile SMD can package.

Engineered for demanding temperature and assembly environments, this part supports operation from –40°C to +105°C, is AEC-Q200 qualified, and is RoHS compliant — making it suitable for automotive-grade and industrial surface-mount designs that require reliable, compact bulk or decoupling capacitance.

Key Features

• Electrical Performance — 33 µF capacitance at a 6.3 V rating with ±20% tolerance; polarized device suitable for DC filtering and energy storage in compact circuits.
• Low-profile SMD Can Package — Chip-type radial can intended for surface mounting with dimensions L: 4.5 × D: 5 mm and a maximum seated height of 4.5 mm; recommended PCB land size 5.3 × 5.3 mm.
• Wide Temperature Range — Rated for continuous operation from –40°C to +105°C, supporting use across harsh thermal environments.
• Reliability & Endurance — 1000 hours endurance at 105°C; for rated voltages ≤16 V (including 6.3 V), capacitance change after endurance is within ±25% of the initial value.
• Ripple Current & Frequency Response — Rated ripple current: 26 mA at 120 Hz and 39 mA at 10 kHz; frequency coefficient for ripple current is 1.00 at 120 Hz and 1.50 at 10 kHz or more, enabling predictable performance across frequency ranges.
• Leakage and Dissipation — Leakage current after 2 minutes at 20°C does not exceed 0.01CV or 3 µA (whichever is greater); tan δ (loss factor) at 6.3 V is specified with a maximum of 0.38 at 120 Hz, 20°C.
• Assembly Compatibility — Designed for automatic mounting machines and supplied in carrier tape format for high-volume surface-mount assembly.
• Qualification & Compliance — AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), supporting regulated and automotive ecosystems.

Typical Applications

• Automotive Electronics — Suitable for control modules and electronic assemblies that require AEC-Q200 qualified, surface-mount capacitors with wide temperature range performance.
• Compact Surface-Mount PCBs — Low-profile chip can and small footprint make this part a fit for high-density boards where board space and vertical clearance are constrained.
• Automated Assembly Lines — Carrier-tape compatibility and SMD can package support high-throughput automatic placement and reflow processes.

Unique Advantages

• Automotive-grade Reliability: AEC-Q200 qualification signals suitability for designs that demand established automotive component standards.
• Wide Operating Temperature: –40°C to +105°C operation helps maintain capacitance stability and functionality across harsh thermal conditions.
• Engineered for High-density Boards: Low-profile 4.5 mm height and compact footprint reduce PCB area and enable slim form-factor assemblies.
• Predictable Endurance: 1000 hours at 105°C with defined capacitance limits provides clear, specification-driven expectations for long-term use.
• Assembly-friendly Packaging: Carrier-tape compatibility and SMD can style streamline automated placement and reduce assembly cycle time.
• Regulatory Compliance: RoHS compliance supports environmental and regulatory requirements for modern electronics production.

Why Choose UZT0J330MCL1GB?

UZT0J330MCL1GB combines a compact, chip-style SMD can with verified AEC-Q200 qualification and a wide –40°C to +105°C operating range, delivering a reliable solution for automotive and industrial surface-mount designs. Its electrical characteristics — 33 µF at 6.3 V, defined ripple current behavior, and controlled leakage/tan δ — make performance predictable across frequency and temperature conditions.

This part is ideal for engineers and procurement teams building space-constrained, high-density PCBs that must meet automotive or regulated-environment requirements and that benefit from components optimized for automated assembly and long-term endurance.

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