UZS1V220MCL1GB
| Part Description |
22 µF 35 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 576 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UZS |
| Manufacturer | Nichicon |
| Manufacturing Status | End Of Life |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 22 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 4.6 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 85°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 85°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 69 mA @ 10 kHz | Ripple Current Low Frequency | 46 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 4.5 x 6.3 mm | Surface Mount Land Size | 6.6 x 6.6 mm | ||
| Tolerance | -20%~20% | Voltage | 35 V |
Overview of UZS1V220MCL1GB – Aluminum Electrolytic Chip Capacitor, 22 µF 35 V
The UZS1V220MCL1GB is a Nichicon UZS-series aluminum electrolytic chip capacitor designed for surface-mount use on high-density PC boards. This polarized, low-profile chip capacitor (4.5 mm height) delivers 22 µF at 35 V with AEC-Q200 qualification and RoHS compliance, making it suited for demanding electronics assemblies that require compact, reliable bulk capacitance.
Engineered for automated surface-mount assembly, the part combines a small footprint with endurance characteristics useful in temperature-stressed environments and automotive electronics applications.
Key Features
- Core Electricals — 22 µF capacitance at a 35 V rated voltage with ±20% tolerance (120 Hz, 20°C); polarized for DC decoupling and bulk storage.
- Package & Mounting — Chip-type aluminum electrolytic in an SMD radial can style sized L: 4.5 × D: 6.3 mm and designed for automatic placement from carrier tape; recommended land size 6.6 × 6.6 mm.
- Temperature & Lifetime — Operating range −40°C to +85°C with endurance specified as 2000 hours at 85°C under rated voltage.
- Ripple Performance — Rated ripple current of 46 mA at 120 Hz and 69 mA at 10 kHz (frequency-dependent coefficients apply per datasheet).
- Electrical Reliability — Leakage current limit after 2 minutes at 20°C is 0.01 CV or 3 µA (whichever is greater); tan δ (max.) for 35 V is 0.14 at 120 Hz, 20°C.
- Compliance & Qualification — RoHS directive compliant and AEC‑Q200 rated (as provided in product data).
Typical Applications
- Automotive Electronics — AEC‑Q200 qualification and compact SMD form factor make it appropriate for automotive control and support circuits on dense PCBs.
- High-density Surface-mount Assemblies — Chip-type package and carrier-tape compatibility enable automatic placement in tightly packed boards where board space is constrained.
- Power Filtering on Compact Boards — Bulk capacitance and specified ripple current ratings support local decoupling and smoothing in compact power sections.
Unique Advantages
- Compact, low-profile SMD form — 4.5 mm height and small L×D footprint allow integration into space-constrained PCB layouts while retaining useful capacitance.
- Automated assembly ready — Designed for carrier-tape feeding and automatic placement to streamline high-volume manufacturing.
- Automotive-grade qualification — AEC‑Q200 rating supports use in designs that require recognized automotive reliability metrics.
- Measured ripple and endurance data — Specified ripple current at both low and high frequencies plus a 2000-hour endurance at 85°C give designers defined performance targets for thermal and electrical stress.
- Regulatory compliance — RoHS compliance simplifies environmental regulatory planning for assemblies.
Why Choose UZS1V220MCL1GB?
UZS1V220MCL1GB positions itself as a compact, specification-driven aluminum electrolytic solution for engineers needing 22 µF at 35 V in surface-mount, high-density PCB designs. With AEC‑Q200 qualification, defined ripple current ratings, and endurance data at elevated temperature, it is well suited to applications where traceable electrical and thermal performance is required.
This part is a practical fit for design teams focused on reliable bulk capacitance in constrained footprints—especially where automated placement and regulatory compliance (RoHS) are important selection criteria.
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Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016