UZS1H2R2MCL1GB

The UZS1H2R2MCL1GB is a chip-type aluminum electrolytic capacitor in a compact surface-mount package, specified for 2.2 µF at 50 V. It is designed for placement on high-density printed circuit boards and is compatible with automated mounting processes using carrier tape.

With AEC-Q200 rating and RoHS compliance, this part addresses reliability and environmental requirements for automotive and other demanding electronic assemblies while offering a small footprint for space-constrained designs.

Key Features

• Compact SMD Chip Package — 4.5 mm nominal case height with physical dimensions L: 4.5 × D: 4 mm, enabling use on high-density surface-mount PCBs.
• Electrical Rating — 2.2 µF capacitance at a 50 V rated voltage with ±20% tolerance, suitable for applications requiring polarized bulk or decoupling capacitance.
• Automated Assembly Compatible — Designed for use with carrier-tape fed automatic mounting machines to streamline high-volume production.
• Automotive-Grade Reliability — AEC-Q200 listed rating and an operating temperature range of –40°C to +85°C to meet automotive and similarly demanding application environments.
• Endurance and Temperature Performance — Endurance specified as 2000 hours at 85°C; stability and impedance characteristics are defined across the rated temperature range.
• Ripple Current Characteristics — Rated ripple current figures include 13 mA at 120 Hz and 19.5 mA at 10 kHz, with frequency coefficients provided in the series datasheet.
• Low Leakage Specification — Leakage current specified as not more than 0.01 CV or 3 µA (whichever is greater) after 2 minutes at 20°C, per the datasheet test condition.
• Assembly Land Size — Recommended PCB land footprint L: 4.3 × W: 4.3 mm for reliable soldering and placement.

Typical Applications

• Automotive electronic modules — AEC-Q200 rating and –40°C to +85°C operation make this capacitor suitable for use on space-constrained automotive PCBs that require reliable SMD components.
• Control and power electronics — Compact chip form factor supports bulk or decoupling capacitance on high-density control boards and power-management circuits.
• Sensor and ECU boards — Small footprint and automated assembly compatibility help integrate the capacitor into embedded sensor interfaces and electronic control units.

Unique Advantages

• Small footprint for dense layouts: The chip-type 4.5 × 4.0 mm package minimizes board area while providing required capacitance.
• Production-friendly mounting: Carrier-tape compatibility streamlines pick-and-place assembly and reduces handling time in manufacturing.
• Designed to automotive-grade standards: AEC-Q200 listing supports deployment in regulated and reliability-focused environments.
• Defined endurance and temperature specs: 2000 hours at 85°C and a –40°C to +85°C operating range provide clear expectations for long-term performance.
• Clear electrical limits: Explicit leakage current and ripple current specifications allow designers to evaluate behavior under real-world conditions.
• RoHS compliant: Meets the referenced environmental directive for restricted substances.

Why Choose UZS1H2R2MCL1GB?

UZS1H2R2MCL1GB combines a compact surface-mount chip package with automotive-grade reliability and clearly specified electrical characteristics, making it a practical choice for engineers working on space-constrained, high-density PCBs. Its carrier-tape compatibility supports efficient automated assembly, while defined endurance, leakage and ripple current metrics simplify design validation.

This part is suited for customers developing control, sensing, and power electronics where small size, AEC-Q200 listing, and traceable performance data are required. The clear specification set helps engineering and procurement teams assess fit for production and long-term operation.

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