UZS1H4R7MCL1GB
| Part Description |
4.7 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 949 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UZS |
| Manufacturer | Nichicon |
| Manufacturing Status | End Of Life |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 4.7 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 4.6 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 85°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 85°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 30 mA @ 10 kHz | Ripple Current Low Frequency | 20 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 4.5 x 5 mm | Surface Mount Land Size | 5.3 x 5.3 mm | ||
| Tolerance | -20%~20% | Voltage | 50 V |
Overview of UZS1H4R7MCL1GB – Aluminum Electrolytic Chip Capacitor, 4.7 µF / 50 V
The UZS1H4R7MCL1GB is an aluminum electrolytic, chip-type capacitor from Nichicon’s UZS series designed for surface-mount use on high-density PC boards. It offers 4.7 µF capacitance at 50 V in a compact SMD can package suited for automated placement with carrier tape.
Built to meet automotive-grade qualification (AEC-Q200) and RoHS directives, this part targets compact power-filtering and decoupling applications where space, reliability and standardized manufacturing are important. The component is specified for operation from –40°C to +85°C with a rated endurance of 2000 hours at 85°C under rated voltage.
Key Features
- Capacitance & Voltage — 4.7 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance for predictable bulk and decoupling behavior.
- Compact SMD Can Package — Chip-type radial can package with dimensions L: 4.5 × D: 5 mm, suitable for high-density board designs and automated placement from carrier tape.
- Surface-mount Land Pattern — Recommended land size L: 5.3 × W: 5.3 mm to support reliable soldering and board layout.
- Automated Assembly Compatibility — Applicable to automatic mounting machines fed with carrier tape to streamline high-volume production.
- Thermal & Endurance — Operating temperature range of –40°C to +85°C and rated endurance of 2000 hours at 85°C with rated voltage applied; capacitance change remains within ±20% after endurance test.
- Ripple Performance — Specified ripple current: 20 mA at 120 Hz and 30 mA at 10 kHz, with frequency coefficients provided for other frequencies.
- Leakage Current — After 2 minutes at rated voltage and 20°C, leakage current is ≤ 0.01·C·V or 3 μA, whichever is greater.
- Standards & Compliance — AEC-Q200 compliant and RoHS (2011/65/EU, (EU)2015/863) compliant.
Typical Applications
- Automotive Control Modules — Compact energy storage and decoupling on control and sensor PCBs where AEC-Q200 qualification is required.
- Power Supply Filtering — Local bulk filtering and ripple suppression on 50 V rails in space-constrained assemblies.
- Sensor and Interface Electronics — Decoupling and transient energy buffering in compact sensor interfaces and signal-conditioning circuits.
Unique Advantages
- Compact SMD Can Form Factor: Small 4.5 × 5 mm footprint enables high-density PC board layouts without sacrificing capacitance.
- Automated Assembly Ready: Designed for carrier-tape feeding to support automated pick-and-place for high-volume manufacturing.
- Automotive-Grade Qualification: AEC-Q200 compliance supports use in designs that require automotive-level component qualification.
- Extended Endurance: Rated 2000 hours at 85°C under rated voltage with controlled capacitance change, supporting durability in elevated-temperature environments.
- RoHS Compliant: Meets current RoHS directives for environmentally regulated designs.
Why Choose UZS1H4R7MCL1GB?
UZS1H4R7MCL1GB is positioned for engineers needing a compact, surface-mount aluminum electrolytic capacitor with automotive-grade qualification and predictable endurance characteristics. Its combination of 4.7 µF at 50 V, compact can package, automated-assembly compatibility and specified ripple/leakage behavior makes it suitable for compact power-filtering and decoupling functions on high-density PCBs.
Designed by Nichicon as part of the UZS series, this part offers a clear specification set for teams focused on reliable, manufacturable designs that operate across –40°C to +85°C and require AEC-Q200-level qualification and RoHS compliance.
If you would like pricing, availability, or to request a quote for UZS1H4R7MCL1GB, please contact our sales team to discuss your requirements and lead times.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016