UZS1H4R7MCL1GB

CAP ALUM 4.7UF ±20% 50V SMD
Part Description

4.7 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 949 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUZS
ManufacturerNichicon
Manufacturing StatusEnd Of Life
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance4.7 µFECCNEAR99
ESRN/AHeight Seated (Max)4.6 mmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp2000 h @ 85°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40°C - 85°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency30 mA @ 10 kHzRipple Current Low Frequency20 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension4.5 x 5 mmSurface Mount Land Size5.3 x 5.3 mm
Tolerance-20%~20%Voltage50 V

Overview of UZS1H4R7MCL1GB – Aluminum Electrolytic Chip Capacitor, 4.7 µF / 50 V

The UZS1H4R7MCL1GB is an aluminum electrolytic, chip-type capacitor from Nichicon’s UZS series designed for surface-mount use on high-density PC boards. It offers 4.7 µF capacitance at 50 V in a compact SMD can package suited for automated placement with carrier tape.

Built to meet automotive-grade qualification (AEC-Q200) and RoHS directives, this part targets compact power-filtering and decoupling applications where space, reliability and standardized manufacturing are important. The component is specified for operation from –40°C to +85°C with a rated endurance of 2000 hours at 85°C under rated voltage.

Key Features

  • Capacitance & Voltage — 4.7 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance for predictable bulk and decoupling behavior.
  • Compact SMD Can Package — Chip-type radial can package with dimensions L: 4.5 × D: 5 mm, suitable for high-density board designs and automated placement from carrier tape.
  • Surface-mount Land Pattern — Recommended land size L: 5.3 × W: 5.3 mm to support reliable soldering and board layout.
  • Automated Assembly Compatibility — Applicable to automatic mounting machines fed with carrier tape to streamline high-volume production.
  • Thermal & Endurance — Operating temperature range of –40°C to +85°C and rated endurance of 2000 hours at 85°C with rated voltage applied; capacitance change remains within ±20% after endurance test.
  • Ripple Performance — Specified ripple current: 20 mA at 120 Hz and 30 mA at 10 kHz, with frequency coefficients provided for other frequencies.
  • Leakage Current — After 2 minutes at rated voltage and 20°C, leakage current is ≤ 0.01·C·V or 3 μA, whichever is greater.
  • Standards & Compliance — AEC-Q200 compliant and RoHS (2011/65/EU, (EU)2015/863) compliant.

Typical Applications

  • Automotive Control Modules — Compact energy storage and decoupling on control and sensor PCBs where AEC-Q200 qualification is required.
  • Power Supply Filtering — Local bulk filtering and ripple suppression on 50 V rails in space-constrained assemblies.
  • Sensor and Interface Electronics — Decoupling and transient energy buffering in compact sensor interfaces and signal-conditioning circuits.

Unique Advantages

  • Compact SMD Can Form Factor: Small 4.5 × 5 mm footprint enables high-density PC board layouts without sacrificing capacitance.
  • Automated Assembly Ready: Designed for carrier-tape feeding to support automated pick-and-place for high-volume manufacturing.
  • Automotive-Grade Qualification: AEC-Q200 compliance supports use in designs that require automotive-level component qualification.
  • Extended Endurance: Rated 2000 hours at 85°C under rated voltage with controlled capacitance change, supporting durability in elevated-temperature environments.
  • RoHS Compliant: Meets current RoHS directives for environmentally regulated designs.

Why Choose UZS1H4R7MCL1GB?

UZS1H4R7MCL1GB is positioned for engineers needing a compact, surface-mount aluminum electrolytic capacitor with automotive-grade qualification and predictable endurance characteristics. Its combination of 4.7 µF at 50 V, compact can package, automated-assembly compatibility and specified ripple/leakage behavior makes it suitable for compact power-filtering and decoupling functions on high-density PCBs.

Designed by Nichicon as part of the UZS series, this part offers a clear specification set for teams focused on reliable, manufacturable designs that operate across –40°C to +85°C and require AEC-Q200-level qualification and RoHS compliance.

If you would like pricing, availability, or to request a quote for UZS1H4R7MCL1GB, please contact our sales team to discuss your requirements and lead times.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1950


    Headquarters: Nakagyo, Kyoto, Japan


    Employees: 5,000+


    Revenue: $1.2 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up