UZT0J101MCL1GB

The UZT0J101MCL1GB is a chip-style aluminum electrolytic capacitor engineered for surface-mount use on high-density printed circuit boards. It combines a compact SMD can package with a wide operating temperature range and industry-grade qualification for demanding applications.

Targeted for board-level power and decoupling roles—including automotive electronics—the part delivers 100 µF at 6.3 V in a low-profile 4.5 mm height package that is compatible with carrier-tape automated placement.

Key Features

• Package & Mounting Chip-type SMD aluminum electrolytic in a radial can-style case sized L: 4.5 × D: 6.3 mm; designed for surface mounting on high-density PC boards and compatible with carrier-tape automatic mounting.
• Electrical Specification 100 µF nominal capacitance at a rated voltage of 6.3 V with ±20% tolerance and polarized construction.
• Operating Temperature & Lifetime Rated for operation from –40 °C to +105 °C with an endurance rating of 1000 hours at 105 °C.
• Ripple Performance & Frequency Response Rated ripple current of 52 mA at 120 Hz and 78 mA at 10 kHz; frequency coefficients apply (e.g., 1.00 at 120 Hz, 1.50 at 10 kHz or higher).
• Reliability & Qualification AEC-Q200 qualified and RoHS-compliant, with datasheet-defined endurance, leakage, tan δ and soldering-heat characteristics.
• Board Land & Assembly Recommended surface-mount land size L: 6.6 × W: 6.6 mm; black top marking for polarity identification.

Typical Applications

• Automotive electronics AEC-Q200 qualification and a –40 °C to +105 °C range make the capacitor suitable for automotive electronic modules where board-level electrolytic capacitance is required.
• High-density SMD assemblies The chip-type, low-profile can is designed for surface mounting on densely populated PCBs where board space and component height are constrained.
• Automated assembly lines Compatible with carrier-tape feeding for automatic placement, supporting high-volume PCB assembly processes.

Unique Advantages

• Compact, low-profile SMD form factor: Enables capacitance of 100 µF in a small footprint (4.5 × 6.3 mm) for space-constrained designs.
• Wide operating temperature: –40 °C to +105 °C rating supports deployment across a broad range of operating environments.
• AEC-Q200 qualification: Provides an established reliability baseline for automotive and other demanding applications.
• Designed for automated production: Carrier-tape compatibility simplifies high-volume pick-and-place assembly and reduces handling steps.
• Defined endurance and soldering robustness: Specified 1000 hours at 105 °C endurance and resistance to soldering heat (250 °C, 30 s) for predictable long-term behavior.
• RoHS compliant: Meets current environmental directives for lead-free assemblies.

Why Choose UZT0J101MCL1GB?

The UZT0J101MCL1GB balances compact dimensions with the electrical and environmental specifications expected for board-level electrolytic capacitance in modern assemblies. Its combination of 100 µF/6.3 V electrical rating, low-profile SMD can, AEC-Q200 qualification and compatibility with automated placement makes it well suited for engineers specifying robust capacitors for automotive and other high-reliability applications.

This part is a practical choice for designs that require reliable bulk or decoupling capacitance in tight spaces, predictable endurance at elevated temperatures, and straightforward integration into automated manufacturing flows.

Request a quote or contact sales to discuss availability, pricing, and lead times for UZT0J101MCL1GB. Technical details and datasheet information are available on request to support integration and qualification in your designs.