UZS1V100MCL1GB

The UZS1V100MCL1GB is a Nichicon aluminum electrolytic chip capacitor in a compact surface-mount, radial can package optimized for high-density PC boards. It delivers 10 µF capacitance at a 35 V rating with a low-profile 4.5 mm chip height and is designed for automated placement from carrier tape.

Targeted for applications requiring AEC-Q200 rated components and RoHS compliance, this part provides defined endurance and ripple-current characteristics for reliable power-decoupling and bulk-storage duties across −40°C to +85°C.

Key Features

• Capacitance & Voltage — 10 µF nominal capacitance with a 35 V rated voltage and ±20% tolerance at 120 Hz, 20°C.
• Compact SMD Package — Chip-type radial can SMD package sized L: 4.5 × D: 5 mm and a 4.5 mm height for dense board layouts; recommended land pattern L: 5.3 × W: 5.3 mm.
• Automated Assembly Friendly — Designed for surface mounting on high-density PC boards and compatible with automatic mounting equipment fed by carrier tape.
• Reliability & Endurance — Endurance specified as 2000 hours at 85°C with rated voltage applied; after recovery to 20°C, capacitance remains within ±20% and leakage current remains at or below initial limits.
• Temperature Range — Rated for operation from −40°C to +85°C.
• Ripple Current Performance — Specified ripple current: 29 mA at 120 Hz and 43.5 mA at 10 kHz, with frequency coefficients provided for other frequencies.
• Leakage Current Specification — After 2 minutes at rated voltage and 20°C, leakage is specified as not more than 0.01 CV or 3 µA, whichever is greater.
• Compliance — RoHS compliant and noted as AEC-Q200 compliant in the product documentation.

Typical Applications

• Power supply decoupling — Bulk and local decoupling on compact power rails where a low-profile SMD electrolytic is required.
• Embedded control modules — Energy storage and smoothing on high-density PCBs used in control and sensor interfaces.
• Industrial and automotive electronics — Used where AEC-Q200 compliance and specified endurance at elevated temperature are required.

Unique Advantages

• Space-efficient form factor: Low-profile 4.5 mm chip height and small footprint simplify routing and allow denser component placement.
• AEC-Q200 compliant documentation: Provides traceable qualification data suitable for designs that reference AEC-Q200 requirements.
• Application-focused endurance: 2000 hours at 85°C with defined post-test limits gives predictable lifecycle behavior for thermal-stressed applications.
• Measurable ripple handling: Published ripple-current values at 120 Hz and 10 kHz enable straightforward thermal budgeting in power designs.
• Assembly-ready packaging: Designed for tape-fed automatic placement to speed PCB assembly and reduce handling variation.
• Regulatory compliance: RoHS conformity supports environmental and regulatory needs for many industrial supply chains.

Why Choose UZS1V100MCL1GB?

The UZS1V100MCL1GB balances a compact SMD footprint with clearly specified electrical and environmental performance from a recognized manufacturer, Nichicon. Its documented endurance, leakage limits and ripple-current specifications make it suitable for designs that require predictable behavior across −40°C to +85°C and where AEC-Q200 information is required.

This part is most appropriate for engineers and buyers working on space-constrained modules that need a small, surface-mount electrolytic with defined reliability characteristics. The combination of automated-assembly compatibility and RoHS compliance supports efficient production and regulatory alignment.

Request a quote or contact sales to check current availability, discuss unit pricing, or to obtain additional technical documentation and support for using UZS1V100MCL1GB in your designs. Note: this product is scheduled for discontinuation and is not recommended for new designs.