UZS1E330MCL1GB

The UZS1E330MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It provides 33 µF capacitance at a 25 V rated voltage in a compact SMD can package (L: 4.5 × D: 6.3 mm) and is suitable for automated assembly on carrier tape.

This part is RoHS compliant and AEC-Q200 compliant. Products are scheduled to be discontinued and this part is not recommended for new designs.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance with a 25 V rated voltage and ±20% tolerance, suitable for a range of decoupling and bulk-storage needs within that rating.
• Compact SMD Can Package — Chip-type aluminum can in an SMD format with dimensions L: 4.5 × D: 6.3 mm, designed for high-density PCB layouts.
• Surface-Mount & Assembly Ready — Designed for surface mounting and compatible with automatic mounting machines fed by carrier tape to support high-volume production.
• Automotive-Grade Qualification — AEC-Q200 compliant, supporting designs that require automotive component qualification.
• Environmental Compliance — RoHS compliant to the 2011/65/EU and (EU)2015/863 directives.
• Temperature & Lifetime — Rated for operation from −40 °C to +85 °C with a specified endurance of 2000 hours at 85 °C under rated voltage.
• Ripple Current Performance — Specified ripple current: 52 mA at 120 Hz and 78 mA at 10 kHz, with frequency coefficients provided in the series datasheet.

Typical Applications

• Automotive Electronics — Suited for automotive modules and electronics where AEC-Q200 qualification is required.
• High-Density Surface-Mount PCBs — Compact chip form factor enables use on space-constrained boards for decoupling and energy storage.
• Automated Assembly Lines — Carrier-tape compatibility and SMD package make it appropriate for high-volume automated placement processes.

Unique Advantages

• AEC-Q200 Compliance: Supports designs that demand automotive-grade component qualification and defined reliability expectations.
• SMD Chip Format: Small can-style SMD package (4.5 × 6.3 mm) helps reduce board footprint while delivering 33 µF of capacitance.
• Assembly Efficiency: Designed for automatic mounting with carrier tape to streamline pick-and-place and reflow assembly workflows.
• Wide Operating Range: Rated for −40 °C to +85 °C operation and endurance tested for 2000 hours at 85 °C, providing predictable behavior across temperature extremes within that range.
• Measured Ripple Performance: Specified ripple current values at 120 Hz and 10 kHz allow designers to size capacitors against expected AC stress.
• Regulatory Compliance: RoHS compliance ensures conformance with common environmental directives.

Why Choose UZS1E330MCL1GB?

UZS1E330MCL1GB delivers a compact, surface-mount aluminum electrolytic solution for applications requiring 33 µF at 25 V with automotive-capable qualification. Its chip can package and carrier-tape compatibility make it a practical choice where board density and automated assembly are priorities.

This part is appropriate for engineers and procurement teams seeking a qualified, production-ready SMD aluminum capacitor with documented ripple current, endurance at elevated temperature, and RoHS compliance. Note that these units are scheduled for discontinuation and are not recommended for new designs.

If you would like pricing, availability, or a formal quote for UZS1E330MCL1GB, please request a quote or contact sales to discuss your requirements and inventory status.