UZS1C330MCL1GB

The UZS1C330MCL1GB is a Nichicon UZS series aluminum electrolytic chip capacitor in a compact chip-can SMD package. Engineered for surface mounting on high‑density PC boards, it delivers 33 µF capacitance at a 16 V rating with polarized construction and industry-recognized reliability credentials.

Targeted at demanding electronic systems, this component is suitable for applications requiring a small-footprint, automotive-capable electrolytic solution with defined ripple-current ratings and proven endurance at elevated temperature.

Key Features

• Capacitance & Voltage — 33 µF rated capacitance at 16 V for decoupling, filtering and bulk energy storage in compact assemblies.
• Compact Chip Can Package — Radial, can‑style SMD package with size dimensions L: 4.5 × D: 6.3 mm and recommended land size L: 6.6 × W: 6.6 mm for high‑density board layouts.
• Surface Mount Ready — Chip type designed for surface mounting on high‑density PC boards and compatible with automatic mounting machines fed with carrier tape.
• Wide Temperature Range — Rated for operation from −40 °C to +85 °C to suit a range of environmental conditions.
• AEC‑Q200 & RoHS Compliance — AEC‑Q200 rating and compliance with the RoHS directive (2011/65/EU, (EU)2015/863) for regulated applications.
• Endurance — Specified endurance of 2000 hours at 85 °C with rated voltage applied; capacitance change is within ±20% after endurance testing per the datasheet.
• Leakage & Loss Characteristics — Leakage current limited to 0.01 CV or 3 µA (whichever is greater) after 2 minutes at 20 °C; tangent of loss angle (tan δ) max 0.19 at 16 V (120 Hz, 20 °C).
• Ripple Current Ratings — Rated ripple currents of 49 mA at 120 Hz and 73.5 mA at 10 kHz, with frequency coefficients defined in the series datasheet for higher-frequency operation.

Typical Applications

• Automotive Electronics — Useful in electronic control modules and sensor interfaces where AEC‑Q200 qualification and compact SMD packaging are required.
• Power Filtering — Bulk decoupling and smoothing in point‑of‑load and power conditioning circuits on space‑constrained PCBs.
• Embedded Control Systems — Decoupling and transient energy support for microcontroller and analog front‑end circuits in compact assemblies.

Unique Advantages

• AEC‑Q200 Qualified: Provides a recognized level of reliability for automotive and similarly demanding applications where a qualification baseline is required.
• Compact, Mountable Form Factor: Chip‑can SMD design and tape‑feed compatibility simplify automated assembly in high‑density board designs.
• Defined Endurance Performance: 2000‑hour endurance at 85 °C under rated voltage gives predictable aging behavior and design margin for thermal stress.
• Low Leakage Specification: Tight leakage limits (0.01 CV or 3 µA) support low‑power designs and precision analog circuits.
• Frequency‑specified Ripple Handling: Published ripple current values at 120 Hz and 10 kHz allow designers to size capacitors for expected ripple profiles across common frequency ranges.

Why Choose UZS1C330MCL1GB?

The UZS1C330MCL1GB balances compact packaging with measurable, application‑oriented electrical and environmental specifications. Its AEC‑Q200 rating, RoHS compliance, and defined endurance and leakage characteristics make it a practical choice for engineers specifying reliable electrolytic capacitance in constrained PCB layouts.

This part is well suited to designs that need a small SMD electrolytic with clear ripple current and temperature endurance data—particularly in automotive and industrial control domains where qualification and predictable performance matter.

For pricing, availability, and to request a formal quote or submit an inquiry, please contact sales with the part number UZS1C330MCL1GB and your project requirements.