UZS1A330MCL1GB

The UZS1A330MCL1GB is an aluminum electrolytic, chip-type capacitor in a compact surface-mount package, rated at 33 µF and 10 V. Its chip construction and embossed carrier taping are designed for high-density PCBs and automated SMT assembly.

Engineered for applications requiring polarized bulk capacitance in a small footprint, this device provides defined endurance and electrical characteristics suitable for demanding electronic assemblies, including automotive applications where AEC-Q200 compliance is required.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance at a rated voltage of 10 V with ±20% tolerance.
• Chip, Surface-Mount Package — Chip-type, radial can SMD package sized φ5 × 4.5 mm (L: 4.5 × D: 5 mm) with a recommended land size of 5.3 × 5.3 mm.
• Low Leakage & Dissipation — Leakage current specified as 3.3 µA; tan δ of 0.24 (max.) at 120 Hz, 20°C for the 10 V rating.
• Ripple Current Capability — Rated ripple current values: 41 mA at 120 Hz and 61.5 mA at 10 kHz, with frequency coefficients provided in the series datasheet.
• Temperature & Endurance — Operating range –40°C to +85°C and endurance of 2000 hours at 85°C under rated voltage.
• Automotive-Grade Reliability — AEC-Q200 compliant and RoHS compliant, meeting requirements for automotive electronic systems where the standard is specified.
• Assembly-Ready Packaging — Supplied in embossed carrier taping compatible with automatic mounting machines for high-throughput SMT placement.

Typical Applications

• Automotive — Suitable for automotive electronic assemblies where AEC-Q200 compliance is required.
• High-density PCB Designs — Designed for surface mounting on high-density PC boards where compact bulk capacitance is needed.
• Automated SMT Assembly — Packaged for feed from embossed carrier tape and compatible with automatic mounting equipment.

Unique Advantages

• Compact SMD footprint: φ5 × 4.5 mm package minimizes board area while delivering 33 µF of capacitance.
• Automated assembly ready: Embossed carrier taping enables efficient pick-and-place for volume production.
• Defined endurance at elevated temperature: Rated for 2000 hours at 85°C, providing predictable lifetime behavior under specified conditions.
• Automotive-capable qualification: AEC-Q200 compliance supports use where this qualification is specified.
• Low leakage and controlled dissipation: Specified leakage current (3.3 µA) and tan δ (0.24) give predictable performance for decoupling and smoothing tasks within rated conditions.
• RoHS compliant: Meets RoHS directive requirements for lead-free assembly compatibility.

Why Choose UZS1A330MCL1GB?

The UZS1A330MCL1GB combines a compact chip-type SMD form factor with defined electrical and reliability specifications, making it well suited to high-density PCBs and automated production lines. With AEC-Q200 compliance and a clear endurance rating (2000 hours at 85°C), it addresses use cases that require automotive-grade qualification and predictable long-term behavior under rated conditions.

Choose this capacitor when you need a polarized aluminum electrolytic in a small, assembly-friendly package with verifiable leakage, ripple, and dissipation characteristics from a recognized series offering. Its packaging and dimensional data simplify integration into automated manufacturing workflows.

If you need pricing, lead-time or availability information, request a quote or contact sales to submit an inquiry and obtain a formal quotation.