UZS0J330MCL1GB

The UZS0J330MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface mounting on high-density PCBs. It delivers 33 µF capacitance at a 6.3 V rating in a compact SMD can package, targeting embedded and automotive electronics that require reliable power filtering and decoupling in tight layouts.

Built for automated assembly and compliance-sensitive designs, the part combines AEC-Q200 qualification, RoHS compliance, and measurable endurance at elevated temperature to support robust designs in demanding environments.

Key Features

• Package & Mounting Chip-type SMD can designed for surface mounting on high-density PC boards; compatible with automatic mounting machines fed with carrier tape.
• Electrical Characteristics 33 µF capacitance with ±20% tolerance at 120 Hz, 20°C, and rated voltage of 6.3 V. Low-frequency ripple current of 37 mA (120 Hz) and high-frequency ripple current of 55.5 mA (10 kHz) are provided.
• Size & Land Pattern Compact dimensions L: 4.5 × D: 5 mm and recommended surface-mount land size L: 5.3 × W: 5.3 mm for dense board layouts.
• Reliability & Endurance AEC-Q200 rated; endurance specified as 2000 hours at 85°C with capacitance change within ±20% and leakage current remaining within initial limits after recovery.
• Leakage & Loss Leakage current after 2 minutes at 20°C is ≤ 0.01 CV or 3 μA (whichever is greater). Specified tan δ values for 6.3 V operation support predictable ESR behavior.
• Operating Environment Rated for operation from –40°C to +85°C, suitable for temperature-variable applications that require stable capacitance over this range.
• Compliance RoHS compliant and AEC-Q200 compliant, addressing environmental and automotive reliability requirements.

Typical Applications

• Automotive Electronics Use in compact automotive control modules where AEC-Q200 qualification and small footprint are required for local filtering and decoupling.
• Power Supply Filtering Bulk smoothing and output decoupling on compact DC/DC converters and point-of-load circuits in space-constrained designs.
• High-Density PCBs Decoupling and energy storage in densely populated consumer or industrial PCBs where surface-mount can capacitors fit automated assembly flows.

Unique Advantages

• Compact chip-style SMD package Minimizes board area and enables placement on high-density PCBs while remaining compatible with automated pick-and-place and tape-fed assembly.
• AEC-Q200 compliance Provides a level of component reliability and qualification useful for designs that require automotive-grade component selection.
• Measurable endurance at elevated temperature Rated for 2000 hours at 85°C with defined limits on capacitance, tan δ and leakage current, supporting predictable life-cycle planning.
• Low leakage specification Leakage current limited to 0.01 CV or 3 μA after initial application of rated voltage, aiding low-current and standby-power designs.
• Frequency-aware ripple data Provided ripple currents and frequency coefficients allow engineers to estimate performance across common switching frequencies.
• RoHS compliance Supports regulatory and environmental requirements for lead-free assembly and restricted substances.

Why Choose UZS0J330MCL1GB?

UZS0J330MCL1GB combines a compact SMD can form factor with automotive-grade qualification and clear endurance and leakage specifications, making it suitable for designers who need dependable filtering and decoupling in space-constrained assemblies. Its carrier-tape compatibility and defined ripple/temperature behavior simplify integration into automated production and ensure predictable electrical performance.

This capacitor is a practical choice for engineers designing robust, compliant systems where a small footprint, defined lifetime at elevated temperature, and controlled leakage are important design considerations.

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