UZS0G470MCL1GB

The UZS0G470MCL1GB is a surface‑mount aluminum electrolytic chip capacitor offering 47 µF capacitance at a 4 V rating in a compact φ4 × 4.5 mm package. It is designed for high‑density PCB assembly with embossed carrier taping for automated placement.

Designed to address demanding power‑decoupling and filtering needs, this AEC‑Q200 rated, RoHS‑compliant part delivers measurable performance: tanδ 0.5 (120 Hz, 20 °C), low leakage current (3 µA), and defined ripple current capability for both low and high frequency conditions. Status: End Of Life — products are scheduled for discontinuation and are not recommended for new designs.

Key Features

• Capacitance & Voltage: 47 µF nominal capacitance with ±20% tolerance, rated for 4 V operation.
• Compact Surface‑Mount Package: Chip‑type aluminum can in a φ4 × 4.5 mm package (surface mount) suitable for high density PCBs; supplied in embossed carrier taping for automatic placement.
• Electrical Performance: Tangent of loss angle (tanδ) 0.5 at 120 Hz, 20 °C; leakage current specified at 3 µA (after 2 minutes at rated voltage, 20 °C).
• Ripple Current Capability: Low frequency ripple current 33 mA at 120 Hz and high frequency ripple current 49.5 mA at 10 kHz, supporting both mains‑frequency and high‑frequency decoupling needs.
• Temperature & Endurance: Operating range −40 °C to +85 °C with endurance specified as 2000 hours at 85 °C under rated voltage.
• Automotive Grade: AEC‑Q200 rated for designs requiring automotive‑grade component qualification.
• Compliance: RoHS compliant per provided product data.

Typical Applications

• Automotive Electronics: Suitable for AEC‑Q200 qualified automotive modules where 4 V, compact power decoupling is required (e.g., sensor power rails, control modules).
• Power Supply Decoupling: Local bulk and decoupling capacitor for low‑voltage power rails on high‑density PCBs, supporting both low and high frequency ripple conditions.
• Embedded Systems: Compact energy‑storage and smoothing in small form‑factor embedded boards and modules requiring surface‑mount assembly.

Unique Advantages

• Small form factor for dense layouts: φ4 × 4.5 mm chip‑type can enables placement in tight board real estate while maintaining useful capacitance.
• Clear high‑frequency behavior: Specified ripple current at 10 kHz (49.5 mA) ties directly to the 120 Hz value (33 mA) via the series frequency coefficient, allowing predictable HF derating planning.
• Automotive qualification: AEC‑Q200 rating supports use in applications requiring automotive‑grade component selection and traceability.
• Defined endurance and thermal window: 2000 hours at 85 °C endurance and −40 °C to +85 °C operating range provide a clear performance envelope for lifetime and thermal design decisions.
• Manufacturing ready: Embossed carrier tape packaging supports automated pick‑and‑place processes for efficient production integration.

Why Choose UZS0G470MCL1GB?

UZS0G470MCL1GB delivers a compact, surface‑mount aluminum electrolytic solution with explicit electrical and endurance specifications—making it suitable for designs that need measurable ripple handling, low leakage, and a defined lifetime at elevated temperature. Its AEC‑Q200 rating and RoHS compliance make it an option where automotive‑grade qualification and regulatory compliance are required.

This part fits applications that prioritize compactness and predictable capacitor behavior across frequency and temperature. Note that the part is End Of Life; availability and lead‑time should be confirmed when planning replacement or last‑time buys.

Request a quote or submit an availability inquiry for UZS0G470MCL1GB to receive current pricing and lead‑time information.