UZR1V4R7MCL1GB

CAP ALUM 4.7UF ±20% 35V SMD
Part Description

4.7 µF 35 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,551 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUZR
ManufacturerNichicon
Manufacturing StatusEnd Of Life
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance4.7 µFECCNEAR99
ESRN/AHeight Seated (Max)3.95 mmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp1000 h @ 85°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40°C - 85°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency27 mA @ 10 kHzRipple Current Low Frequency18 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension3.9 x 4 mmSurface Mount Land Size4.3 x 4.3 mm
Tolerance-20%~20%Voltage35 V

Overview of UZR1V4R7MCL1GB – Surface‑Mount Aluminum Electrolytic Capacitor, 35 V / 4.7 µF

The UZR1V4R7MCL1GB is a surface‑mount aluminum electrolytic capacitor offering 4.7 µF capacitance at a rated voltage of 35 V in a compact chip‑type package. It is engineered for high‑density PCB assembly and is supplied in embossed carrier tape for compatibility with automatic mounting machines.

Designed and specified for automotive use, the part combines defined endurance and electrical characteristics—including low leakage and controlled loss angle—within an RoHS‑compliant, AEC‑Q200 rated package.

Key Features

  • Electrical performance — 4.7 µF nominal capacitance with ±20% tolerance and a rated voltage of 35 V; tangent of loss angle (tan δ) specified at 0.14 for the 35 V rating.
  • Low leakage — Leakage current specified at 3 µA, providing predictable standby behavior after voltage application.
  • Ripple current — Rated ripple current of 18 mA at 120 Hz (low frequency) and 27 mA at 10 kHz (high frequency) for AC stress considerations.
  • Temperature and endurance — Operating range from −40 °C to +85 °C with a rated lifetime of 1000 hours at 85 °C and defined endurance characteristics after the test period.
  • Compact SMD package — Chip‑type radial can SMD with case dimension φ4 × 3.9 mm (L), seated height max 3.9 mm; recommended PCB land size 4.3 × 4.3 mm.
  • Assembly ready — Supplied in embossed carrier taping and marked with black print on the case top for automated pick‑and‑place processes.
  • Compliance and qualification — RoHS compliant and AEC‑Q200 rated, supporting deployment in automotive electronic designs.

Typical Applications

  • Automotive electronics — Intended for use in automotive systems where AEC‑Q200 qualification and robust electrical characteristics are required.
  • High‑density surface‑mount assemblies — Chip‑type form factor and compact footprint enable placement on densely populated PCBs.
  • Automated assembly lines — Embossed carrier taping and SMD can package make the part suitable for automatic mounting machines.

Unique Advantages

  • AEC‑Q200 rated for automotive designs — Formal qualification supports use in automotive electronics and systems that reference component-level automotive ratings.
  • Small footprint, SMD chip profile — φ4 × 3.9 mm case and compact land pattern help optimize board area on space‑constrained designs.
  • Defined endurance and thermal range — 1000 hours at 85 °C and an operating range from −40 °C to +85 °C give clear expectations for life and performance under thermal stress.
  • Predictable electrical behavior — Low leakage current (3 µA) and specified tan δ (0.14 at 35 V) simplify power‑rail design and component selection.
  • Pick‑and‑place compatible — Embossed carrier taping and black top marking streamline automated assembly and traceability.
  • RoHS compliant — Meets RoHS directive requirements for material composition.

Why Choose UZR1V4R7MCL1GB?

UZR1V4R7MCL1GB delivers a compact, surface‑mount aluminum electrolytic solution with defined electrical and endurance specifications tailored for automotive and other high‑reliability surface‑mount applications. Its combination of AEC‑Q200 rating, RoHS compliance, low leakage, and chip‑type packaging supports integration into automated, high‑density PCB assemblies where known performance and assembly readiness matter.

This part is suited to engineers and procurement teams specifying components for designs that require automotive‑grade qualification, compact form factor, and automated assembly compatibility while relying on clear, datasheet‑defined endurance and electrical characteristics.

If you would like pricing, lead‑time, or technical assistance for integrating UZR1V4R7MCL1GB into your design, request a quote or contact sales to discuss your requirements.

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    Date Founded: 1950


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