UZR1H3R3MCL1GB

The UZR1H3R3MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface-mount applications. It delivers 3.3 µF capacitance at a 50 V rating in a compact φ4 × 3.9 mm package intended for high-density PCBs and automated assembly.

This part is AEC-Q200 rated for automotive use, RoHS compliant, and optimized for automated placement via embossed carrier taping. Note: this product is listed as end of life / discontinued.

Key Features

• Capacitance & Voltage — 3.3 µF rated capacitance at 50 V with ±20% tolerance (120 Hz, 20°C).
• Low Dissipation — tanδ 0.14 (max) at 20°C and 120 Hz, supporting stable AC performance at rated conditions.
• Leakage Current — Low leakage current: 3 µA (after 2 minutes' application of rated voltage at 20°C or 0.01CV, whichever is greater).
• Ripple Current Capability — Ripple current 17 mA at 120 Hz (low frequency) and 25.5 mA at 10 kHz (high frequency).
• Reliability & Lifetime — Endurance specified to 1000 hours at 85°C with defined limits for capacitance change, tanδ, and leakage current.
• Package & Mounting — Chip-type radial can SMD package for surface mount; embossed carrier taping compatible with automatic mounting equipment. Surface mount land size: 4.3 × 4.3 mm.
• Operating Range — Rated for −40°C to +85°C operation.
• Qualification & Compliance — AEC-Q200 rated and RoHS compliant.
• Polarized Construction — Polarized electrolytic capacitor suitable for typical DC decoupling and filtering roles in power circuits.

Typical Applications

• Automotive Electronics — Designed for automotive control modules and electronic assemblies where AEC-Q200 qualification is required.
• High-Density Surface-Mount Boards — Compact chip form factor fits tightly packed PCBs for power filtering and decoupling in space-constrained designs.
• Automated Manufacturing — Embossed carrier tape packaging enables efficient pick-and-place assembly for volume production.

Unique Advantages

• Compact SMD Profile: φ4 × 3.9 mm chip form reduces board area while providing electrolytic capacitance for power circuits.
• Automotive-Grade Qualification: AEC-Q200 rating supports use in automotive electronic subassemblies requiring component-level reliability.
• Low Leakage Current: 3 µA maximum leakage at 20°C helps minimize standby power loss in sensitive systems.
• Low Dissipation Factor: tanδ 0.14 at 20°C/120 Hz supports efficient AC performance under rated conditions.
• Manufacturing Friendly: Embossed carrier tape and SMD package streamline automated placement and high-density board assembly.
• Durability at Elevated Temperature: 1000 hours rated life at 85°C provides defined endurance characteristics for thermally demanding environments.

Why Choose UZR1H3R3MCL1GB?

UZR1H3R3MCL1GB provides a compact, automotive-capable electrolytic solution for designers needing 3.3 µF at 50 V in surface-mount form. Its combination of AEC-Q200 qualification, low leakage, defined ripple current performance, and embossed carrier taping make it a practical choice for automated production and dense PCB layouts.

The part is suited to applications that require a robust electrolytic capacitor with verified endurance at elevated temperature and controlled dissipation. Because this item is listed as end of life / discontinued, request availability details before specifying it into new production designs.

Request a quote or submit an availability inquiry to receive pricing and lead-time information for UZR1H3R3MCL1GB.