UZS0G221MCL1GB

The UZS0G221MCL1GB is a chip‑type aluminum electrolytic capacitor from Nichicon’s UZS series, specified at 220 µF and 4 V. It is designed for surface mounting on high‑density PC boards and is compatible with automated assembly processes using carrier tape.

This part combines compact dimensions and series‑level qualifications—including AEC‑Q200 compliance and RoHS conformity—making it suitable where space, automated placement and regulated component standards are required. Note: this product is scheduled to be discontinued and is not recommended for new designs.

Key Features

• Capacitance & Voltage — 220 µF capacitance rated at 4 V, with a tolerance of ±20% (120 Hz, 20°C).
• Compact Chip Package — Chip‑type radial can SMD with case dimensions L: 4.5 × D: 6.3 mm and a surface mount land size of 6.6 × 6.6 mm.
• Mounting & Assembly — Designed for surface mounting on high‑density printed circuit boards and compatible with automatic mounting machines fed with carrier tape.
• Reliability & Endurance — Endurance specified as 2000 hours at 85°C with the rated voltage applied; meets series endurance criteria for capacitance, tan δ and leakage current after restoration to 20°C.
• Temperature Range — Operational from −40°C to +85°C, suitable for applications within this operating window.
• Ripple Current & Loss — Rated ripple currents of 96 mA at 120 Hz and 144 mA at 10 kHz; tangent of loss angle (tan δ) maximum for 4 V is 0.50 (measured at 120 Hz, 20°C).
• Leakage Current Specification — After 2 minutes at rated voltage and 20°C, leakage current is specified as not more than 0.01CV or 3 µA, whichever is greater.
• Standards & Compliance — AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Suitable where AEC‑Q200 qualified aluminum electrolytic capacitance is required within the stated operating temperature and endurance limits.
• High‑Density PCB Designs — Compact chip package tailored for space‑constrained boards that require surface‑mount electrolytic capacitance.
• Automated Assembly Lines — Compatible with carrier‑tape fed automatic mounting machines for high‑volume production.
• RoHS‑Compliant Systems — For designs that require materials and processes conforming to RoHS directives.

Unique Advantages

• AEC‑Q200 Qualification: Offers series‑level automotive qualification for applications that require AEC‑Q200 reliability verification.
• Space‑Saving Chip Form Factor: Small 4.5 × 6.3 mm package footprint and specified land pattern (6.6 × 6.6 mm) help reduce board area and support dense layouts.
• Assembly‑Friendly: Designed for tape‑and‑reel automated placement, simplifying high‑volume manufacturing and placement consistency.
• Documented Endurance: 2000 hours at 85°C with rated voltage applied provides a clear endurance baseline for thermal and voltage stress planning.
• Measurable Electrical Limits: Clear specifications for leakage current, tan δ and ripple current allow predictable integration into power and decoupling networks.
• Regulatory Compliance: RoHS conformity supports usage in regulated markets and reduces material compliance overhead.

Why Choose UZS0G221MCL1GB?

UZS0G221MCL1GB delivers a compact, surface‑mount aluminum electrolytic solution with defined electrical and reliability parameters—220 µF at 4 V, AEC‑Q200 qualification, RoHS compliance, and documented endurance and leakage limits. Its chip form and tape‑feed compatibility make it a practical choice for designs that prioritize PCB density and automated assembly.

This part is well suited to designers and procurement teams working on existing production lines or repair/maintenance stocks that require a qualified, documented electrolytic capacitor form factor. Please note that the product is scheduled to be discontinued and is not recommended for new designs.

If you would like pricing or availability information, request a quote or submit a purchase inquiry and our team will respond with current stock and ordering options.