UZS1A220MCL1GB

The UZS1A220MCL1GB is a chip-type aluminum electrolytic capacitor in Nichicon’s UZS series, optimized for surface-mount applications on high-density PC boards. It delivers 22 µF capacitance at a 10 V rating in a compact 4.5 mm × 5 mm package footprint suitable for automated tape-fed assembly.

Engineered for reliable operation in demanding environments, the part is AEC-Q200 rated and RoHS-compliant, with an operating temperature range of –40°C to +85°C and endurance specified for 2000 hours at 85°C.

Key Features

• Electrical Performance — 22 µF capacitance at 10 V with ±20% tolerance, designed for polarized DC applications.
• Low-profile SMD Package — Chip-type aluminum electrolytic in a compact package (L: 4.5 × D: 5 mm) for space-constrained board designs.
• Mounting & Assembly — Surface-mount design compatible with automatic mounting machines using carrier tape; recommended PCB land size: 5.3 × 5.3 mm.
• Temperature & Reliability — Rated for –40°C to +85°C operation; endurance: 2000 hours at 85°C with capacitance change within ±20% and leakage current within initial specified limits after test.
• Ripple Current Characteristics — Ripple current specified at 33 mA (120 Hz) and 49.5 mA (10 kHz); frequency coefficients provided in the UZS series data.
• Compliance & Qualification — AEC-Q200 compliant and RoHS directive (2011/65/EU.(EU)2015/863) compliant.

Typical Applications

• Automotive Electronics — Suitable for AEC-Q200-qualified modules in automotive systems requiring compact, board-level energy storage.
• High-density PCB Assemblies — Low-profile chip form factor and small board land footprint make it suitable for tight-layout power or decoupling placements.
• Automated Production — Designed for compatibility with carrier-tape automated mounting processes to support high-volume SMT assembly.

Unique Advantages

• AEC-Q200 Qualification: Provides a qualification baseline for designs requiring component-level automotive reliability.
• Compact, Low-profile Form Factor: 4.5 mm height and 4.5 × 5 mm body reduce board stack height and free PCB real estate for other components.
• Assembly-friendly Packaging: Carrier-tape compatible SMD chip type simplifies integration into automated pick-and-place workflows.
• Verified Endurance: Endurance rating of 2000 hours at 85°C gives predictable life performance for thermally stressed applications.
• Regulatory Compliance: RoHS compliance supports environmental and regulatory requirements in commercial and automotive supply chains.

Why Choose UZS1A220MCL1GB?

UZS1A220MCL1GB combines a compact SMD chip package with AEC-Q200 qualification and clearly defined endurance and temperature specifications, making it a practical choice for engineers designing compact, reliable power and decoupling solutions for automotive and other demanding applications. Its carrier-tape compatibility and small PCB land requirement help streamline automated assembly and optimize board layouts.

For projects that require predictable ripple handling, a defined lifetime at elevated temperature, and adherence to RoHS and AEC-Q200 standards, the UZS1A220MCL1GB provides a specification-driven component option from the Nichicon UZS series.

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