UZS1C100MCL1GB

The UZS1C100MCL1GB is a Nichicon UZS-series aluminum electrolytic chip capacitor in a compact surface-mount can package. It delivers 10 µF at 16 V in a chip-type form factor designed for high-density PC boards and automated carrier-tape mounting.

Engineered for regulated environments, this part is AEC-Q200 compliant and RoHS compliant, with an operating temperature range of −40 °C to +85 °C and an endurance rating of 2000 hours at 85 °C, making it suitable for demanding electronic assemblies in the automotive market.

Key Features

• Electrical — Capacitance & Voltage — Rated at 10 µF and 16 V with a capacitance tolerance of ±20% (at 120 Hz, 20 °C).
• Polarized Electrolytic — Polar aluminum electrolytic construction for DC applications requiring compact bulk capacitance.
• Ripple Current Performance — Specified ripple current of 23 mA at 120 Hz and 34.5 mA at 10 kHz; frequency coefficients provided for scaling ripple current across frequencies (e.g., 1.00 at 120 Hz, 1.50 at 10 kHz or more).
• Package & Mounting — Chip-type surface-mount can with dimensions L: 4.5 × D: 4 mm and recommended land size L: 4.3 × W: 4.3 mm; compatible with automatic mounting machines using carrier tape.
• Reliability & Endurance — AEC-Q200 rated with endurance specification: capacitance change within ±20%, tan δ within 200% of initial specified value, and leakage current ≤ initial specified value after 2000 hours at 85 °C with rated voltage applied.
• Temperature & Leakage — Operating range −40 °C to +85 °C; leakage current after 2 minutes at 20 °C is ≤ 0.01 CV or 3 µA (whichever is greater).
• Environmental Compliance — RoHS compliant (2011/65/EU and (EU)2015/863).

Typical Applications

• Automotive Electronics — Designed for automotive electronic modules where AEC-Q200 compliance and a compact surface-mount capacitor are required for reliable operation across −40 °C to +85 °C.
• High-Density PCB Assemblies — Chip form factor and carrier-tape compatibility make this part suitable for automated placement in space-constrained boards.
• Power Supply Modules — Provides bulk capacitance in DC power circuits within its 16 V rating and specified ripple current capabilities.

Unique Advantages

• Compact SMD Can — Small L: 4.5 × D: 4 mm footprint enables placement in tight board areas without sacrificing capacitance.
• AEC-Q200 Compliance — Meets automotive-grade component requirements for use in vehicle electronics that call out AEC-Q200-rated parts.
• Automated Assembly Ready — Designed for carrier-tape feeding and surface-mount placement, streamlining pick-and-place assembly and reducing manual handling.
• Specified Endurance — 2000 hours at 85 °C with defined post-test limits on capacitance, tan δ, and leakage current provides a verifiable reliability baseline for design qualification.
• Frequency-Aware Ripple Handling — Published ripple current values and frequency coefficients allow engineers to size and predict thermal/ripple behavior across application frequencies.
• Regulatory Compliance — RoHS conformity ensures alignment with lead-free and restricted-substance requirements.

Why Choose UZS1C100MCL1GB?

The UZS1C100MCL1GB combines a compact SMD can package with automotive-grade AEC-Q200 qualification and RoHS compliance, delivering a reliable aluminum electrolytic option for space-constrained, automated assemblies. Its specified endurance at 85 °C, operating range from −40 °C to +85 °C, and detailed ripple-current data make it suitable for engineers who need verifiable performance data for design validation.

Manufactured by Nichicon, this part is aimed at designers and procurement teams building robust electronic modules—particularly in automotive and other regulated markets—where a balance of size, verified endurance, and assembly compatibility is required.

If you would like pricing, availability, or a formal quote for UZS1C100MCL1GB, please request a quote or contact sales for assistance and lead-time information.