UZS1E220MCL1GB

The UZS1E220MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface mounting on high-density printed circuit boards. It combines a compact SMD can package with AEC-Q200 qualification and RoHS compliance for use in automotive and industrial board-level applications where space and reliability are important.

This part is designed for automated assembly (carrier-tape fed) and offers a balance of capacitance, voltage rating and endurance for use across temperature ranges from −40°C to +85°C. Note: products in this series are scheduled to be discontinued and are not recommended for new designs.

Key Features

• Capacitance & Voltage — 22 µF rated capacitance at 25 V, with a tolerance of ±20% (measured at 120 Hz, 20°C).
• Compact SMD Can Package — Chip-type aluminum can (SMD) with dimensions L: 4.5 × D: 6.3 mm and a surface-mount land size of 6.6 × 6.6 mm, optimized for high-density PCB layouts.
• Low Profile — 4.5 mm seated height for constrained vertical clearance applications.
• Automated Assembly Ready — Designed for surface mounting on carrier tape compatible with automatic mounting machines to streamline production.
• Reliability & Endurance — AEC-Q200 compliant with endurance specified as 2000 hours at 85°C when the rated voltage is applied, and operating temperature range of −40°C to +85°C.
• Polarized Electrolytic — Polarized design for DC decoupling and bulk energy storage in power circuits.
• Ripple Current Characteristics — Rated ripple currents: 42 mA at 120 Hz and 63 mA at 10 kHz; frequency coefficients are provided for scaling ripple at other frequencies (e.g., 120 Hz = 1.00, 10 kHz = 1.50).
• Environmental Compliance — RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronic modules — Designed for use in automotive systems requiring AEC-Q200 qualified passive components on compact PCBs.
• High-density PCB assemblies — Low-profile chip format and small footprint make it suitable where board area and height are constrained.
• Automated production lines — Carrier-tape compatible for efficient pick-and-place and reflow assembly in volume manufacturing.

Unique Advantages

• AEC-Q200 qualification: Meets AEC-Q200 requirements to support automotive-grade reliability expectations where specified.
• Compact form factor: 4.5 × 6.3 mm can package and 4.5 mm height enable power filtering in space-constrained designs.
• Assembly-friendly: Carrier-tape compatibility simplifies automated mounting and reduces manual handling during production.
• Endurance under heat: Specified 2000 hours at 85°C with rated voltage applied provides a defined reliability metric for lifetime planning.
• Ripple handling with frequency scaling: Published ripple current values and frequency coefficients allow designers to size parts accurately across application frequencies.
• Regulatory compliance: RoHS conformity supports environmental and material restrictions in supply chains.

Why Choose UZS1E220MCL1GB?

UZS1E220MCL1GB delivers a compact, surface-mount aluminum electrolytic solution with documented endurance and ripple-current characteristics, combined with AEC-Q200 and RoHS compliance. Its chip-type can package and carrier-tape compatibility make it a practical choice for automated assembly of space-constrained board designs, particularly in automotive and related industrial applications where an AEC-Q200-rated electrolytic capacitor is required.

Because this series is scheduled for discontinuation and is not recommended for new designs, UZS1E220MCL1GB is best suited for sustaining existing designs, maintenance, or replacement in current production where matching form, fit and qualification are needed.

Request a quote or submit an availability inquiry for UZS1E220MCL1GB to review current stock, lead times, and pricing for your project needs.