UZS1E4R7MCL1GB

The UZS1E4R7MCL1GB is a surface‑mount aluminum electrolytic chip capacitor specified at 4.7 µF and 25 V. It is designed for high‑density PCB assembly and automatic placement, offering a compact SMD can package (4.0 mm diameter × 4.5 mm length) suitable for space‑constrained designs.

Targeted at demanding electronics applications, the part combines AEC‑Q200 qualification, RoHS compliance and electrical characteristics—including low leakage and defined ripple current performance—to support reliable power filtering in compact assemblies across a wide temperature range.

Key Features

• Capacitance and Voltage — 4.7 µF rated capacitance at 25 V with ±20% tolerance (measured at 120 Hz, 20°C).
• Low Leakage — Leakage current specified at 3 µA after 2 minutes at 20°C, providing predictable standby behavior for power rails.
• Loss Factor (tan δ) — tanδ maximum of 0.16 at 25 V (measured at 120 Hz, 20°C), enabling known dissipation performance for design margin calculations.
• Ripple Current Ratings — Low‑frequency ripple current 16 mA at 120 Hz and high‑frequency ripple current 24 mA at 10 kHz, with frequency coefficients defined in the series datasheet.
• Endurance and Temperature Range — Rated for 2000 hours at 85°C with operating range from −40°C to +85°C, with specified post‑endurance limits for capacitance, tanδ and leakage.
• Package and Assembly — Chip type SMD can (φ4.0 × 4.5 mm) designed for surface mounting on high‑density PCBs and compatible with embossed carrier taping for automatic placement.
• Quality and Compliance — AEC‑Q200 rated and RoHS compliant, supporting regulated environments and industry reliability expectations.

Typical Applications

• Automotive Electronics — Suitable where AEC‑Q200 components are required for vehicle electronics modules and assemblies.
• High‑Density SMD Assemblies — Chip‑type package and embossed carrier taping make it appropriate for compact, automated surface‑mount production.
• On‑Board Power Modules — Provides capacitance and controlled leakage characteristics useful for local energy storage and smoothing on compact power rails.

Unique Advantages

• Compact SMD Can — Small footprint (4.0 mm × 4.5 mm) reduces board space while delivering electrolytic capacitance for tight layouts.
• Automated Assembly Ready — Embossed carrier taping compatibility enables efficient placement in high‑volume SMT processes.
• Defined Endurance — 2000 hours at 85°C endurance rating with clear post‑test limits supports predictable lifecycle planning.
• Predictable Electrical Parameters — Specified tanδ, leakage current and ripple current values allow accurate thermal and performance budgeting in designs.
• AEC‑Q200 and RoHS — Conforms to AEC‑Q200 and RoHS requirements to meet regulatory and quality expectations for regulated applications.

Why Choose UZS1E4R7MCL1GB?

UZS1E4R7MCL1GB positions itself as a compact, specification‑driven aluminum electrolytic SMD capacitor for designs requiring a small footprint, controlled leakage and defined ripple handling. With AEC‑Q200 recognition, 2000‑hour endurance at 85°C and RoHS compliance, it offers a reliable component choice for engineers addressing thermal, electrical and assembly constraints.

This part is well suited to engineers and procurement teams specifying capacitors for compact assemblies and applications that demand traceable electrical parameters, automated placement compatibility and clear endurance data for lifetime planning.

Request a quote or contact our sales team to discuss availability, lead times and pricing for UZS1E4R7MCL1GB.