GWC1H151MCX1GS
| Part Description |
150 µF 50 V ±20% Hybrid Polymer Aluminum Capacitor, SMD |
|---|---|
| Quantity | 1,678 Available (as of November 2, 2026) |
| Product Category | Aluminum - Polymer Capacitors |
|---|---|
| Part Series | GWC |
| Manufacturer | Nichicon |
| Manufacturing Status | New Item |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive, High Temperature Reflow | Capacitance | 150 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | 17 mOhm @ 100 kHz | Height Seated (Max) | 1.3 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 4000 h @ 135°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 135°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Unknown | Ripple Current High Frequency | 3.3 A @ 100 kHz | Ripple Current Low Frequency | 495 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 12.5 x 10 mm | Surface Mount Land Size | 10.3 x 10.3 mm | ||
| Tolerance | -20%~20% | Voltage | 50 V |
Overview of GWC1H151MCX1GS – Conductive Polymer Hybrid Aluminum Electrolytic Capacitor, 150 µF, 50 V, 135°C, SMD
The GWC1H151MCX1GS is a surface-mount conductive polymer hybrid aluminum electrolytic capacitor engineered for high-temperature, high-reliability applications. It delivers 150 µF at 50 V with low impedance characteristics optimized for compact PCB designs that require robust ripple handling and thermal endurance.
Designed for demanding environments, the part combines low ESR, high ripple-current capability and a long rated life—4000 hours at 135°C—making it suitable for systems where space, thermal tolerance and reliability are key design drivers.
Key Features
- Core technology Conductive polymer hybrid aluminum electrolytic construction for reduced impedance compared with traditional electrolytic designs.
- Capacitance & tolerance 150 µF nominal capacitance with tolerance of -20% to +20% (measured at 20°C, 120 Hz).
- Voltage rating Rated for 50 V operation.
- Low loss / low ESR tanδ (DF) 0.10 at 20°C, 120 Hz and ESR of 17 mΩ measured at 20°C, 100 kHz—supporting low-impedance power paths.
- High ripple-current capability 495 mA at 120 Hz (low frequency) and 3.3 A at 100 kHz (high frequency) for effective filtering and decoupling under dynamic loads.
- High-temperature endurance Rated life of 4000 hours at 135°C with specified limits on capacitance change, tanδ and ESR after endurance testing.
- Operating temperature range −55°C to +135°C for extended thermal tolerance in harsh environments.
- Package & assembly Compact SMD can (φ10 × 12.5 mm L / size L: 1.25 × D: 1.00 cm) with embossed carrier taping for automated placement; vibration resistant.
- Reliability & compliance AEC‑Q200 rated and RoHS compliant, targeted at applications that require industry-recognized qualification and lead-free compliance.
- Leakage current Specified leakage current: 75 µA.
Typical Applications
- Automotive electronics Suitable for electronics that require components compliant with AEC‑Q200 and capable of sustained operation at elevated temperatures.
- High-temperature power systems Filtering and decoupling in power supplies and converters used in high-temperature environments due to the 135°C rated life.
- Compact surface-mount designs Low ESR and high ripple-current handling in a small SMD can package for space-constrained PCBs.
Unique Advantages
- Low ESR (17 mΩ at 100 kHz): Enables tighter output voltage regulation and improved transient response in power circuits.
- High ripple-current capability: 3.3 A at 100 kHz and 495 mA at 120 Hz support demanding ripple and decoupling requirements without thermal compromise.
- Long high-temperature life: 4000 hours at 135°C provides predictable endurance for extended deployments in hot environments.
- AEC‑Q200 qualified: Offers an established qualification path for designs targeting automotive and other demanding markets.
- Compact SMD can with tape packaging: φ10 × 12.5 mm form factor and embossed carrier taping simplify automated assembly and help reduce PCB footprint.
- RoHS compliant: Meets lead-free and restricted substance requirements for global electronics production.
Why Choose GWC1H151MCX1GS?
The GWC1H151MCX1GS balances compact SMD packaging with high electrical performance and proven thermal endurance. Its conductive polymer hybrid construction, low ESR and strong ripple-current capability make it well suited to designs where thermal stress, ripple energy and board space are constraints.
This part is positioned for engineers and procurement teams developing robust power delivery and filtering solutions—especially where AEC‑Q200 qualification, long life at elevated temperature and automated assembly compatibility are required. The combination of measurable specifications and long-term reliability supports predictable system behavior and lifecycle planning.
If you would like pricing, availability or a formal quote for GWC1H151MCX1GS, please request a quote or contact sales with your quantity and delivery requirements.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016