PCZ1D101MCL1GS
| Part Description |
100 µF 20 V ±20% Polymer Aluminum Capacitor, SMD |
|---|---|
| Quantity | 577 Available (as of November 3, 2026) |
| Product Category | Aluminum - Polymer Capacitors |
|---|---|
| Part Series | PCZ |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive, High Temperature Reflow | Capacitance | 100 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | 39 mOhm @ 100 kHz | Height Seated (Max) | 7.5 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 150°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 150°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 600 mA @ 100 kHz | Ripple Current Low Frequency | 300 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 7 x 8 mm | Surface Mount Land Size | 8.3 x 8.3 mm | ||
| Tolerance | -20%~20% | Voltage | 20 V |
Overview of PCZ1D101MCL1GS – Conductive Polymer Aluminum Solid Electrolytic Capacitor, 100 µF, 20 V
The PCZ1D101MCL1GS is a Nichicon conductive polymer aluminum solid electrolytic chip capacitor in an SMD can package. It delivers 100 µF at 20 V with low ESR and high ripple-current capability for demanding thermal and vibration environments.
Engineered for high-temperature operation and reliability, this part targets automotive and other high-temperature electronic systems where long endurance, AEC‑Q200 qualification, and lead‑free reflow compatibility are required.
Key Features
- Capacitance & Voltage — 100 µF nominal capacitance at a rated voltage of 20 V with ±20% tolerance (120 Hz, 20°C).
- Conductive Polymer Construction — Solid conductive polymer electrolyte for stable electrical performance and reduced leakage compared with traditional wet electrolytes.
- Low ESR & High Ripple Current — ESR specified at 39 mΩ (100 kHz, 20°C) and rated ripple currents of 600 mA at 100 kHz and 300 mA at 120 Hz, supporting efficient power delivery at high frequencies.
- High Temperature Endurance — Rated for operation from −55°C to +150°C with a guaranteed lifespan of 2000 hours at 150°C under rated voltage.
- AEC‑Q200 Qualified — Meets AEC‑Q200 qualification for use in applications that require automotive-grade component-level reliability.
- SMD Can Package & Reflow Ready — Chip-type SMD (radial can) suitable for lead‑free reflow soldering; compatible with peak reflow temperatures up to 260°C under the specified profile.
- Compact Dimension — Small footprint with L: 7 × D: 8 mm and recommended land size of 8.3 × 8.3 mm for space-constrained board designs.
Typical Applications
- Automotive Electronics — Designed for control modules and electronic systems that require AEC‑Q200 qualification and sustained performance at elevated temperatures.
- Power Conversion — Suitable for DC‑DC converters and voltage regulation stages where low ESR and high ripple current improve efficiency and transient response.
- High-Temperature Systems — For electronics operating in elevated ambient temperatures where 2000 hours at 150°C endurance provides extended service life.
Unique Advantages
- High-Temperature Reliability: Specified endurance of 2000 hours at 150°C ensures predictable capacitance and ESR behavior in hot environments.
- Low Losses at High Frequency: 39 mΩ ESR at 100 kHz and a 600 mA ripple current rating at 100 kHz support high-frequency power stages and reduce heat generation.
- Automotive-Grade Qualification: AEC‑Q200 rating provides an added level of component confidence for automotive and similarly demanding applications.
- Lead-Free Reflow Compatibility: SMD can package meets lead‑free reflow profiles up to 260°C peak, enabling modern assembly processes.
- Compact SMD Form Factor: Small footprint and shallow profile allow integration into space-constrained boards without sacrificing performance.
Why Choose PCZ1D101MCL1GS?
The PCZ1D101MCL1GS balances high-temperature endurance, low ESR, and compact SMD packaging to meet the needs of designs that operate under thermal stress or require automotive-grade reliability. Its conductive polymer construction and verified ripple-current handling make it suitable for power conversion and regulation stages where steady performance at elevated frequencies and temperatures is essential.
Manufactured by Nichicon, this part is aimed at engineers and procurement teams specifying components for robust, long-life systems—particularly in automotive and other high-temperature applications—where component-level reliability and lead‑free reflow compatibility matter for production and service lifetime.
Request a quote or contact sales to discuss availability, lead times, and volume pricing for PCZ1D101MCL1GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016