PCZ1J270MCL6GS
| Part Description |
27 µF 63 V ±20% Polymer Aluminum Capacitor, SMD |
|---|---|
| Quantity | 1,466 Available (as of November 3, 2026) |
| Product Category | Aluminum - Polymer Capacitors |
|---|---|
| Part Series | PCZ |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive, High Temperature Reflow | Capacitance | 27 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | 38 mOhm @ 100 kHz | Height Seated (Max) | 1.05 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 150°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 150°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 1.3 A @ 100 kHz | Ripple Current Low Frequency | 650 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 10 x 8 mm | Surface Mount Land Size | 8.3 x 8.3 mm | ||
| Tolerance | -20%~20% | Voltage | 63 V |
Overview of PCZ1J270MCL6GS – Conductive Polymer Aluminum Solid Electrolytic Capacitor, 27 µF 63 V
The PCZ1J270MCL6GS is a conductive polymer aluminum solid electrolytic chip capacitor designed for high-capacitance, high-temperature applications. As an SMD, lead‑free reflow compatible device with AEC‑Q200 qualification, it targets demanding environments where low ESR, high ripple current handling and long-term thermal endurance are required.
Typical use cases include automotive and industrial electronics and other designs that require stable capacitance and reliable performance across a wide temperature range up to 150°C.
Key Features
- Capacitance & Voltage: 27 µF nominal capacitance with a rated voltage of 63 V and ±20% tolerance (at 120 Hz, 20°C).
- High temperature range: Rated operating temperature from -55°C to +150°C with long life performance—2000 hours at 150°C.
- Low ESR & high ripple handling: ESR of 38 mOhm at 100 kHz and ripple current capability of 1.3 A at 100 kHz (1.3 A) and 650 mA at 120 Hz, enabling improved power-handling in tight spaces.
- Reliability and qualification: AEC‑Q200 qualified and designed for high reliability; ESR after endurance is specified at -40°C to confirm low-temperature performance after stress.
- SMD, lead‑free reflow compatible: Chip-type SMD packaged for lead‑free reflow soldering with peak temperature compatibility up to 260°C.
- Leakage current specification: Leakage current meets the datasheet condition of not more than 0.03CV after 2 minutes’ application of rated voltage.
- Compact package: Physical size L: 1.0 cm × D: 0.8 cm with recommended surface mount land size of 8.3 mm × 8.3 mm.
Typical Applications
- Automotive electronics: Suited for in-vehicle systems that require AEC‑Q200 qualification and high-temperature capability, such as control modules and power electronics.
- Power conversion and distribution: Bulk smoothing, decoupling and filtering in DC‑DC converters and power modules where low ESR and high ripple current are needed.
- High-temperature industrial equipment: Power and control circuits operating in elevated ambient temperatures or near heat sources, leveraging the 2000-hour endurance at 150°C.
- Harsh-environment control and sensing: Electronics exposed to wide temperature swings (−55°C to +150°C) that require stable capacitance and reliable long-term operation.
Unique Advantages
- High-temperature endurance: Rated for 2000 hours at 150°C, delivering predictable life performance in elevated-temperature applications.
- Low ESR for efficient power handling: 38 mOhm (100 kHz) combined with high ripple current capability reduces losses and improves thermal performance in power circuits.
- AEC‑Q200 qualification: Provides an added level of component qualification for applications targeting automotive and other demanding industries.
- Lead‑free reflow compatibility: Designed for modern SMD assembly processes with peak reflow compatibility to 260°C, simplifying board-level integration.
- Compact SMD form factor: Chip-type package enables space-saving placement while providing higher capacitance for compact power systems.
Why Choose PCZ1J270MCL6GS?
The PCZ1J270MCL6GS combines conductive polymer aluminum construction with a compact SMD package to deliver low ESR, high ripple current capability and extended thermal endurance up to 150°C. Its AEC‑Q200 qualification and defined endurance characteristics make it a practical choice for engineers designing automotive or high-temperature industrial power and control systems that require reliable long-term performance.
Choose this part when you need a compact, high-capacitance solution that balances thermal robustness, low-loss power handling and compatibility with lead‑free reflow assembly processes.
If you would like pricing, availability or a quotation for PCZ1J270MCL6GS, please submit a request or contact our sales team to discuss your application requirements and obtain a quote.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016