PCZ1V470MCL1GS

CAP ALUM POLY 47UF ±20% 35V SMD
Part Description

47 µF 35 V ±20% Polymer Aluminum Capacitor, SMD

Quantity 876 Available (as of November 3, 2026)
Product CategoryAluminum - Polymer Capacitors
Part SeriesPCZ
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotive, High Temperature ReflowCapacitance47 µFECCNEAR99
ESR44 mOhm @ 100 kHzHeight Seated (Max)7.5 mmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp2000 h @ 150°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-55°C - 150°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency600 mA @ 100 kHzRipple Current Low Frequency300 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension7 x 8 mmSurface Mount Land Size8.3 x 8.3 mm
Tolerance-20%~20%Voltage35 V

Overview of PCZ1V470MCL1GS – Conductive Polymer Aluminum Chip Capacitor (47 µF, 35 V)

The PCZ1V470MCL1GS is a conductive-polymer aluminum solid electrolytic chip capacitor optimized for high-temperature operation and surface-mount assemblies. Designed for demanding environments, it combines low equivalent series resistance and high ripple-current capability with a long endurance rating to meet tough system requirements.

Key markets include automotive electronics and other applications that require AEC-Q200 qualification, elevated operating temperature capability, and lead‑free reflow compatibility.

Key Features

  • Capacitance and Voltage — 47 µF rated at 35 V with ±20% tolerance, providing stable capacitance for SMD power designs.
  • Low ESR and High Ripple Handling — ESR of 44 mΩ at 100 kHz with ripple current ratings of 300 mA (120 Hz) and 600 mA (100 kHz), supporting high-frequency and high-current applications.
  • High-Temperature Performance — Rated for operation from −55 °C to +150 °C and specified for 2000 hours at 150 °C, delivering endurance in elevated-temperature environments.
  • Reliability and Qualification — AEC-Q200 qualified and engineered for high reliability in challenging environments.
  • SMD and Reflow Compatibility — Chip-type, surface-mount package compatible with lead-free reflow soldering up to a 260 °C peak, suitable for standard assembly processes.
  • Compact Package — Small footprint with dimensions L: 7 × D: 8 mm and recommended land size 8.3 × 8.3 mm, enabling space-efficient PCB layouts.
  • Regulatory Compliance — Compliant with RoHS (2011/65/EU, (EU)2015/863).

Typical Applications

  • Automotive electronics — For electronic modules that require AEC-Q200 qualification and sustained operation at elevated temperatures.
  • High-temperature assemblies — Suitable where components must tolerate continuous exposure up to 150 °C and remain reliable over extended periods.
  • SMD power circuits — Used in surface-mount power designs that demand low ESR and strong ripple-current capability in a compact package.

Unique Advantages

  • Predictable high-temperature endurance: Specified for 2000 hours at 150 °C, enabling confident selection for elevated-temperature designs.
  • Measurable low ESR: 44 mΩ at 100 kHz provides verifiable low-loss performance for high-frequency applications.
  • High ripple-current rating: 600 mA (100 kHz) and 300 mA (120 Hz) ratings reduce stress on power rails and support higher dynamic loads.
  • AEC-Q200 qualification: Provides an established automotive-grade reliability baseline for safety- and performance-sensitive designs.
  • Assembly-ready SMD form factor: Chip-type package with lead-free reflow compatibility (260 °C peak) simplifies manufacturing and process integration.
  • RoHS compliant: Meets current environmental directives for lead-free designs.

Why Choose PCZ1V470MCL1GS?

PCZ1V470MCL1GS delivers a balance of electrical performance and thermal endurance for applications that require low ESR, elevated-temperature operation, and industry-recognized qualification. Its conductive-polymer construction and SMD form factor make it suitable where reliable filtering, decoupling, or energy storage is needed in compact, high-temperature-capable assemblies.

This part is well suited to engineers and procurement teams specifying components for automotive-grade and other high-reliability electronic subsystems that demand traceable specifications, reflow compatibility, and long-term thermal stability.

If you would like pricing, availability, or to request a formal quote for PCZ1V470MCL1GS, please request a quote or contact sales to submit your requirements and lead-time needs.

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    Date Founded: 1950


    Headquarters: Nakagyo, Kyoto, Japan


    Employees: 5,000+


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