RHA0J331MCN1GS

The RHA0J331MCN1GS is a conductive polymer aluminum solid electrolytic capacitor in a compact surface-mount can (φ8×6.7 mm). It delivers high capacitance in a low-ESR SMD package designed for general purpose electronic circuits that require high ripple handling and stable performance across a wide temperature range.

Key value propositions include low equivalent series resistance, high frequency ripple capability, and a 2000-hour endurance rating at 105°C—providing designers with a compact, robust solution for power decoupling and smoothing in dense PCB layouts.

Key Features

• Capacitance & Voltage — 330 µF nominal capacitance with a rated voltage of 6.3 V and ±20% tolerance at 120 Hz, 20°C.
• Low ESR — ESR of 9 mΩ measured at 20°C/100 kHz to minimize conduction losses and improve high-frequency response.
• High Ripple Current Capability — Rated ripple current of 450 mA at 120 Hz and up to 4.5 A at 300 kHz for effective suppression of AC ripple across frequencies.
• Temperature & Endurance — Operating temperature range from −55°C to +105°C with a specified life of 2000 hours at 105°C.
• Dielectric Loss (tan δ) — tan δ of 0.12 at 20°C, 120 Hz for predictable AC loss behavior.
• Leakage Current — Specified leakage current of 700 µA (measured after 2 minutes at 20°C under rated voltage).
• Surface-Mount Can Package — φ8×6.7 mm SMD can with recommended land size 8.3 × 8.3 mm; supplied in embossed carrier tape with moisture-proof packing for automated assembly.
• RoHS Compliant & Production Ready — Lead-free reflow compatibility (260°C peak) and mass-production status.

Typical Applications

• General Purpose Electronics — Compact high-capacitance SMD for bulk decoupling and smoothing in a variety of consumer and industrial boards.
• Power Supply Decoupling — Low ESR and high-frequency ripple handling (up to 4.5 A at 300 kHz) make it suitable for decoupling near power regulators and converters.
• Embedded and Handheld Devices — Small φ8×6.7 mm footprint and tape-and-reel packaging support automated assembly for space-constrained designs.
• Industrial Electronics — Rated for −55°C to +105°C and endurance tested at 105°C, providing stability in applications with wide temperature swings.

Unique Advantages

• Compact high-capacitance SMD: 330 µF in a φ8×6.7 mm can reduces board area compared with larger through-hole equivalents.
• Low-loss operation: 9 mΩ ESR at 100 kHz and tan δ 0.12 at 120 Hz lower dissipation and improve efficiency in AC conditions.
• Wide frequency ripple performance: Specified ripple current from 120 Hz to 300 kHz supports both low-frequency smoothing and high-frequency decoupling in the same component.
• Robust temperature endurance: −55°C to +105°C operating range with 2000 hours life at 105°C for reliable long-term operation in demanding environments.
• Production-ready packaging: Embossed carrier tape and moisture-proof packing simplify pick-and-place assembly and inventory handling.
• RoHS-compliant, reflow-capable: Conforms to RoHS and supports lead-free reflow up to a 260°C peak for modern assembly processes.

Why Choose RHA0J331MCN1GS?

RHA0J331MCN1GS combines conductive polymer aluminum dielectric technology with a low-ESR SMD can to deliver 330 µF of capacitance in a compact form factor. Its measured ESR of 9 mΩ at 100 kHz, high ripple current capability, and controlled tan δ make it suitable for designs that need reliable decoupling and smoothing across a broad frequency range.

This part is well suited to engineers and procurement teams building space-constrained, production-volume electronics that require stable performance from −55°C to +105°C, RoHS compliance, and packaging ready for automated assembly.

Request a quote or submit an inquiry to our sales team for pricing, availability, and lead-time information for RHA0J331MCN1GS.