RHA1C331MCN1GS

The RHA1C331MCN1GS is a conductive polymer aluminum solid electrolytic capacitor in a surface-mount radial can package. It delivers 330 µF nominal capacitance at a 16 V rating with a compact φ8 × 8.7 mm case footprint and embossed carrier taping for automated assembly.

Designed for general-purpose electronic applications, this component combines low ESR and high ripple-current capability with a wide operating temperature range and defined endurance at elevated temperature, offering a reliable option for board-level power stabilization and decoupling tasks.

Key Features

• Conductive polymer construction — Solid electrolyte design for stable capacitance and reliable performance in surface-mount assemblies.
• Capacitance & tolerance — 330 µF with ±20% tolerance at 120 Hz, 20°C, providing predictable bulk capacitance for power circuits.
• Rated voltage — 16 V DC rating appropriate for mid-voltage rails.
• Low ESR — ESR of 16 mΩ measured at 20°C / 100 kHz, supporting efficient high-frequency operation.
• High ripple current capability — 400 mA at 120 Hz (low frequency) and 4 A at 300 kHz (high frequency), enabling effective ripple handling across a wide frequency range.
• Loss tangent (tan δ) — 0.12 at 20°C, 120 Hz, for controlled loss behavior in filter and decoupling applications.
• Leakage current — 1056 µA (measured per datasheet condition after application of rated voltage for 2 minutes at 20°C).
• Endurance — Rated for 2000 hours at 105°C under rated voltage conditions, with defined limits on capacitance change, tan δ, ESR and leakage current.
• Temperature range — Operates from −55°C to +105°C.
• Package & assembly — φ8 × 8.7 mm radial can (SMD) with embossed carrier taping and moisture-proof packing; compatible with lead-free reflow peak temperature of 260°C as noted in the series datasheet.
• RoHS compliant — Conforms to RoHS directive requirements.

Typical Applications

• General-purpose electronics — Provides bulk capacitance and filtering for a wide range of board-level designs requiring a 330 µF / 16 V surface-mount capacitor.
• Power rail decoupling — Low ESR (16 mΩ @100 kHz) and high ripple-current capability (up to 4 A @300 kHz) support decoupling and local energy storage on power rails.
• High-frequency filtering — Measured performance at 100 kHz and frequency-coincident ripple ratings make it suitable where high-frequency ripple attenuation is required.

Unique Advantages

• Low ESR for efficient high-frequency operation: 16 mΩ at 20°C / 100 kHz reduces losses and improves filtering effectiveness near switching frequencies.
• High ripple capability across frequencies: Defined ripple current ratings at 120 Hz and 300 kHz provide verified performance for both low- and high-frequency environments.
• Robust thermal endurance: 2000 hours at 105°C under rated voltage gives predictable lifetime behavior in elevated-temperature applications.
• Compact SMD radial can: φ8 × 8.7 mm case balances high capacitance density with a small PCB footprint and automated placement readiness.
• Measured electrical characterization: Specified tan δ, ESR, and leakage current values (measured under documented conditions) enable engineers to model circuit behavior accurately.
• RoHS compliant and lead-free reflow compatible: Supports modern manufacturing and environmental requirements with embossed carrier taping for pick-and-place lines.

Why Choose RHA1C331MCN1GS?

The RHA1C331MCN1GS positions itself as a high-capacitance, low-ESR surface-mount solution for general-purpose electronics where stable bulk capacitance, controlled losses, and verified ripple handling are required. With a 330 µF / 16 V rating, low ESR (16 mΩ at 100 kHz), and documented endurance at 105°C, it provides engineers with measurable parameters to design reliable power decoupling and filtering networks.

This part is suited to engineering teams and procurement looking for a conductive-polymer aluminum capacitor that combines moderate voltage capability, compact SMD packaging, and series-level assembly compatibility. Its defined electrical and thermal specifications support informed design trade-offs and predictable long-term performance.

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