RKS1E330MCNAHGGS

CAP ALUM POLY 33UF ±20% 25V SMD
Part Description

33 µF 25 V ±20% Polymer Aluminum Capacitor, SMD

Quantity 887 Available (as of November 3, 2026)
Product CategoryAluminum - Polymer Capacitors
Part SeriesRKS
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsHigh Temperature ReflowCapacitance33 µFECCNEAR99
ESR30 mOhm @ 100 kHzHeight Seated (Max)8 mmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp3000 h @ 125°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-55°C - 125°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsN/A
REACH ComplianceREACH UnaffectedRipple Current High Frequency1.6 A @ 300 kHzRipple Current Low Frequency160 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension7.7 x 8 mmSurface Mount Land Size8.3 x 8.3 mm
Tolerance-20%~20%Voltage25 V

Overview of RKS1E330MCNAHGGS – 33 µF, 25 V Conductive Polymer Aluminum SMD Capacitor

The RKS1E330MCNAHGGS is a surface-mount conductive polymer aluminum solid electrolytic capacitor offering 33 µF capacitance at 25 V. It delivers low ESR and high allowable ripple current in a compact φ8 × 7.7 mm can-style SMD package designed for demanding power-decoupling and filtering duties.

With a wide operating temperature range of −55 °C to 125 °C and a rated load life of 3000 hours at 125 °C, this capacitor targets applications that require high-frequency performance, robust thermal endurance and reliable long-term operation in compact board layouts.

Key Features

  • Electrical Performance — 33 µF capacitance at 25 V with ±20% tolerance and tanδ of 0.12 (measured at 20 °C, 120 Hz) for predictable AC behavior.
  • Low ESR & High Ripple Capability — ESR of 30 mΩ (measured at 20 °C, 100 kHz) combined with a high-frequency ripple current rating of 1.6 A (at 300 kHz) and 160 mA at 120 Hz for effective smoothing at switching frequencies.
  • Thermal Endurance — Rated for continuous operation from −55 °C to 125 °C and qualified for 3000 hours at 125 °C, supporting designs with elevated ambient or internal temperatures.
  • Surface-Mount Package — Compact φ8 × 7.7 mm radial can configured for SMD assembly with a recommended land pattern of 8.3 × 8.3 mm; supplied in embossed carrier tape with moisture-proof packing for automated placement.
  • Leakage & Reliability — Leakage current specified at 100 µA and endurance/shelf-life characteristics defined per the series datasheet, ensuring stable long-term behavior after soldering and thermal stress.
  • Lead-Free Reflow Compatibility — SMD construction designed for lead-free reflow processes with peak temperature compatibility up to 260 °C per manufacturer reflow conditions.
  • Environmental Compliance — RoHS compliant for conformity with common lead-free requirements.

Typical Applications

  • Power Supply Smoothing — Local energy storage and ripple suppression for DC–DC converters and switching regulators, leveraging the low ESR and high ripple-current rating.
  • High-Frequency Decoupling — AC filtering and decoupling at switching frequencies where 100 kHz ESR and 300 kHz ripple performance reduce voltage ripple on power rails.
  • Industrial Electronics — Bulk decoupling and smoothing in compact assemblies that require elevated temperature endurance and long life at 125 °C.
  • Compact SMD Designs — Board-level energy storage where space is limited but robust ripple handling and reliability are required.

Unique Advantages

  • Low ESR for Efficient Filtering: 30 mΩ ESR at 100 kHz enables improved power conversion efficiency and reduced heating in high-frequency applications.
  • High Ripple-Current Handling: Rated for 1.6 A at 300 kHz (and 160 mA at 120 Hz), supporting heavy switching loads and fast transient currents.
  • Extended High-Temperature Life: 3000 hours at 125 °C provides predictable lifetime performance in thermally demanding environments.
  • SMD-Ready Packaging: Embossed carrier tape and moisture-proof packing simplify automated assembly and long-term storage handling.
  • Lead-Free Reflow Support: Compatible with lead-free reflow profiles up to 260 °C peak for modern assembly processes.
  • Compact Footprint: φ8 × 7.7 mm can format with a small land pattern supports high-density PCB layouts without sacrificing ripple performance.

Why Choose RKS1E330MCNAHGGS?

RKS1E330MCNAHGGS balances low ESR, high ripple-current capability and extended thermal endurance in a compact surface-mount aluminum polymer package. Its specification set — including 33 µF at 25 V, 30 mΩ ESR (100 kHz), 1.6 A ripple current (300 kHz) and 3000-hour life at 125 °C — positions it for designs that demand reliable high-frequency decoupling and durable operation under elevated temperatures.

This part is well suited to engineers and purchasers building compact power subsystems, switching regulators, and industrial electronics where board space, thermal robustness and long-term performance are priorities. RoHS compliance and tape-and-reel moisture-proof packaging streamline production and procurement.

Request a quote or submit a product inquiry to evaluate RKS1E330MCNAHGGS for your design requirements.

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    Date Founded: 1950


    Headquarters: Nakagyo, Kyoto, Japan


    Employees: 5,000+


    Revenue: $1.2 Billion


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