10AX057H3F34I2SG

IC FPGA 492 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 42082304 570000 1152-BBGA, FCBGA

Quantity 416 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O492Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs217080Number of Logic Elements/Cells570000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits42082304

Overview of 10AX057H3F34I2SG – Arria 10 GX Field Programmable Gate Array (FPGA), 1152-FCBGA

The 10AX057H3F34I2SG is an Intel Arria 10 GX series FPGA in a 1152-FCBGA (35×35) surface-mount package designed for mid-range, high-performance applications. This device combines a high logic capacity with abundant embedded RAM and extensive I/O to address compute- and data-intensive tasks across wireless, wireline, broadcast, and compute markets.

Built on the Arria 10 family architecture, the device targets power-sensitive, performance-oriented designs by pairing a 20 nm device architecture with series features such as adaptive logic modules, variable-precision DSP blocks, and support for advanced interfaces and configuration options.

Key Features

  • Core and Logic Capacity 570,000 logic elements and 217,080 logic array blocks provide large programmable fabric for complex algorithms and custom logic implementations.
  • Embedded Memory 42,082,304 total RAM bits of on-chip embedded memory to support large buffering, packet processing, and data storage within the FPGA fabric.
  • I/O and Package 492 user I/O pins in a 1152-FCBGA (35×35) surface-mount package for dense system integration and broad external connectivity.
  • Power and Process Operates from a core voltage supply range of 870 mV to 930 mV and is built on the Arria 10 family’s 20 nm process, designed for power efficiency in mid-range FPGA applications.
  • Temperature and Grade Industrial-grade operation across −40 °C to 100 °C for use in demanding environmental conditions.
  • Advanced Series Features Series-level capabilities include adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, programmable clock networks, PCIe Gen1/Gen2/Gen3 hard IP, support for 10 Gbps Ethernet and Interlaken, and options for dynamic and partial reconfiguration.
  • System Reliability and Configuration Series documentation describes SEU error detection and correction, enhanced configuration methods, and power management features to support robust system design.

Typical Applications

  • Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment benefit from the device’s logic density and embedded memory for signal processing and data aggregation.
  • Wireline Networking Use in 40G/100G muxponders, transponders, and line cards where high I/O count and protocol hard IP (PCIe, Ethernet, Interlaken) support high-throughput packet and frame processing.
  • Broadcast and Professional Video Studio switches, video transport, and conferencing platforms can leverage on-chip memory and DSP resources for real-time video processing and format conversion.
  • Compute and Storage Acceleration Flash cache, cloud server acceleration, and server offload functions that require large on-chip RAM and substantial custom logic capacity.
  • Medical and Defense Systems Diagnostic imaging, radar, and secure communications where industrial temperature range and programmable logic enable specialized processing and interfacing.

Unique Advantages

  • High Logic Density: 570,000 logic elements enable complex algorithm implementation and large-scale custom hardware functions within a single device.
  • Large On-Chip Memory: Over 42 million RAM bits reduce dependence on external memory for buffering and data staging, simplifying system design and latency.
  • Extensive I/O and Compact Package: 492 I/Os in a 1152-FCBGA (35×35) surface-mount package supports dense board-level integration and broad peripheral connectivity.
  • Industrial Temperature Rating: −40 °C to 100 °C operating range supports deployment in harsh and temperature-variable environments.
  • Power-Efficient 20 nm Architecture: Arria 10 family design choices help manage power for mid-range, performance-sensitive applications while providing modern FPGA features.
  • Flexible Configuration and Reliability: Support for dynamic and partial reconfiguration, SEU detection/correction, and rich configuration options aid long-term maintainability and field updates.

Why Choose 10AX057H3F34I2SG?

The 10AX057H3F34I2SG positions itself as a capable mid-range FPGA for designs that require significant logic capacity, large embedded memory, and a high I/O count within a compact 1152-FCBGA package. Its series-level capabilities—programmable DSP blocks, configurable clocking, and support for common high-speed protocols—make it suitable for wireless, wireline, broadcast, compute acceleration, and mission-critical systems.

Backed by Intel Arria 10 device family documentation and device-level reliability features, the part offers scalability and integration for teams developing performance-sensitive, industrial-grade FPGA solutions that require on-board memory, reconfigurability, and thermal robustness.

Request a quote or submit a procurement inquiry today to evaluate 10AX057H3F34I2SG for your next FPGA design.

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