10AX057H3F34I2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 42082304 570000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 416 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 492 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 217080 | Number of Logic Elements/Cells | 570000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 42082304 |
Overview of 10AX057H3F34I2SG – Arria 10 GX Field Programmable Gate Array (FPGA), 1152-FCBGA
The 10AX057H3F34I2SG is an Intel Arria 10 GX series FPGA in a 1152-FCBGA (35×35) surface-mount package designed for mid-range, high-performance applications. This device combines a high logic capacity with abundant embedded RAM and extensive I/O to address compute- and data-intensive tasks across wireless, wireline, broadcast, and compute markets.
Built on the Arria 10 family architecture, the device targets power-sensitive, performance-oriented designs by pairing a 20 nm device architecture with series features such as adaptive logic modules, variable-precision DSP blocks, and support for advanced interfaces and configuration options.
Key Features
- Core and Logic Capacity 570,000 logic elements and 217,080 logic array blocks provide large programmable fabric for complex algorithms and custom logic implementations.
- Embedded Memory 42,082,304 total RAM bits of on-chip embedded memory to support large buffering, packet processing, and data storage within the FPGA fabric.
- I/O and Package 492 user I/O pins in a 1152-FCBGA (35×35) surface-mount package for dense system integration and broad external connectivity.
- Power and Process Operates from a core voltage supply range of 870 mV to 930 mV and is built on the Arria 10 family’s 20 nm process, designed for power efficiency in mid-range FPGA applications.
- Temperature and Grade Industrial-grade operation across −40 °C to 100 °C for use in demanding environmental conditions.
- Advanced Series Features Series-level capabilities include adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, programmable clock networks, PCIe Gen1/Gen2/Gen3 hard IP, support for 10 Gbps Ethernet and Interlaken, and options for dynamic and partial reconfiguration.
- System Reliability and Configuration Series documentation describes SEU error detection and correction, enhanced configuration methods, and power management features to support robust system design.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment benefit from the device’s logic density and embedded memory for signal processing and data aggregation.
- Wireline Networking Use in 40G/100G muxponders, transponders, and line cards where high I/O count and protocol hard IP (PCIe, Ethernet, Interlaken) support high-throughput packet and frame processing.
- Broadcast and Professional Video Studio switches, video transport, and conferencing platforms can leverage on-chip memory and DSP resources for real-time video processing and format conversion.
- Compute and Storage Acceleration Flash cache, cloud server acceleration, and server offload functions that require large on-chip RAM and substantial custom logic capacity.
- Medical and Defense Systems Diagnostic imaging, radar, and secure communications where industrial temperature range and programmable logic enable specialized processing and interfacing.
Unique Advantages
- High Logic Density: 570,000 logic elements enable complex algorithm implementation and large-scale custom hardware functions within a single device.
- Large On-Chip Memory: Over 42 million RAM bits reduce dependence on external memory for buffering and data staging, simplifying system design and latency.
- Extensive I/O and Compact Package: 492 I/Os in a 1152-FCBGA (35×35) surface-mount package supports dense board-level integration and broad peripheral connectivity.
- Industrial Temperature Rating: −40 °C to 100 °C operating range supports deployment in harsh and temperature-variable environments.
- Power-Efficient 20 nm Architecture: Arria 10 family design choices help manage power for mid-range, performance-sensitive applications while providing modern FPGA features.
- Flexible Configuration and Reliability: Support for dynamic and partial reconfiguration, SEU detection/correction, and rich configuration options aid long-term maintainability and field updates.
Why Choose 10AX057H3F34I2SG?
The 10AX057H3F34I2SG positions itself as a capable mid-range FPGA for designs that require significant logic capacity, large embedded memory, and a high I/O count within a compact 1152-FCBGA package. Its series-level capabilities—programmable DSP blocks, configurable clocking, and support for common high-speed protocols—make it suitable for wireless, wireline, broadcast, compute acceleration, and mission-critical systems.
Backed by Intel Arria 10 device family documentation and device-level reliability features, the part offers scalability and integration for teams developing performance-sensitive, industrial-grade FPGA solutions that require on-board memory, reconfigurability, and thermal robustness.
Request a quote or submit a procurement inquiry today to evaluate 10AX057H3F34I2SG for your next FPGA design.

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