10AX057K2F35I1HG

The 10AX057K2F35I1HG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1152-FCBGA (35×35) surface-mount package. It delivers mid-range, high-performance FPGA capability built on the Arria 10 device family architecture and is intended for power‑sensitive, performance‑focused applications across communications, broadcast, computing, medical, and military markets.

Key on-chip resources include high logic capacity, large embedded RAM, and extensive I/O, with operating and supply ranges suited for industrial environments.

Key Features

• High logic capacity — 570,000 logic elements for implementing complex digital functions and system-level integration.
• Embedded memory — 42,082,304 total RAM bits to support large buffering, on-chip data storage, and memory-intensive algorithms.
• Extensive I/O — 492 user I/O pins to interface with external peripherals and high-speed systems.
• Package and mounting — 1152-FCBGA (35×35) package in a surface-mount configuration, suitable for compact board designs.
• Voltage supply — Core supply range of 870 mV to 980 mV, enabling defined low-voltage operation.
• Operating temperature — Rated for −40 °C to 100 °C, appropriate for industrial temperature deployments.
• Industrial grade — The device is specified as Industrial grade per the provided product data.

Typical Applications

• Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment that require high logic density and I/O.
• Wireline networking — 40G/100G muxponders, transponders, and line cards where on-chip memory and logic are used for packet processing and aggregation.
• Broadcast and professional AV — Studio switches, transport and videoconferencing systems needing deterministic FPGA-based signal routing and processing.
• Computing and storage — Server acceleration and flash cache applications that leverage large embedded RAM and programmable logic for acceleration tasks.
• Medical and defense systems — Diagnostic imaging, radar, and secure communications that benefit from the device’s performance profile and industrial temperature rating.

Unique Advantages

• High integration density: 570,000 logic elements reduce the need for multiple discrete devices and simplify system architecture.
• Large on‑chip memory: Over 42 million bits of RAM support substantial buffering and algorithmic state storage without external memory dependency.
• Broad I/O capability: 492 I/O pins enable flexible interfacing with a wide range of peripherals and interconnect standards.
• Industrial temperature operation: Rated from −40 °C to 100 °C to meet the thermal requirements of demanding deployments.
• Compact BGA package: 1152‑FCBGA (35×35) offers a balance of density and board-level integration for space-constrained systems.
• Defined low-voltage core: Core supply window of 870–980 mV supports designs targeting lower power domains.

Why Choose 10AX057K2F35I1HG?

The 10AX057K2F35I1HG brings Arria 10 GX FPGA capability in a compact FCBGA package with high logic density, substantial embedded RAM, and a high I/O count—making it well suited for midrange, performance-driven designs that must balance capacity and power. Its industrial temperature rating and surface-mount package support robust board-level integration for communications, broadcast, compute acceleration, medical imaging, and defense applications.

Selected for designs where on-chip resources and defined operating ranges matter, this Intel Arria 10 device provides a scalable hardware foundation for systems that require significant programmable logic and memory on a single FPGA platform.

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