10AX057K2F35I2LG

IC FPGA 396 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 42082304 570000 1152-BBGA, FCBGA

Quantity 1,000 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time9 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O396Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs217080Number of Logic Elements/Cells570000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits42082304

Overview of 10AX057K2F35I2LG – Arria 10 GX FPGA, 570000 logic elements, 396 I/O, 1152‑FCBGA

The 10AX057K2F35I2LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 1152‑FCBGA (35×35) package for surface‑mount applications. This device is part of the Arria 10 family of 20 nm mid‑range FPGAs and SoCs, designed to deliver higher performance and improved power efficiency for demanding embedded and communications use cases.

With 570000 logic elements, 42,082,304 bits of embedded RAM, and 396 I/O, the device targets mid‑range systems requiring high integration, on‑chip memory capacity, and a variety of high‑speed interface options. It is specified for industrial temperature operation from −40 °C to 100 °C and RoHS compliant.

Key Features

  • Logic Capacity  570000 logic elements provide very large on‑chip programmable logic resources for complex digital designs.
  • Embedded Memory  42,082,304 total RAM bits available for high‑bandwidth buffering, lookup tables, and data storage on‑chip.
  • I/O and Package  396 I/O pins in a high‑density 1152‑FCBGA (35×35) package designed for surface‑mount PCB assembly.
  • Power Supply  Core supply voltage range specified at 870 mV to 980 mV to support the device power domain requirements.
  • Operating Range  Industrial operating temperature from −40 °C to 100 °C to meet demanding environmental conditions.
  • Transceivers and Interfaces  Arria 10 GX family features listed in the device overview include low‑power serial transceivers, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and external memory interface support.
  • Programmability and Reconfiguration  Device overview describes support for dynamic and partial reconfiguration along with configuration and power management features.
  • Reliability and System Features  Datasheet content references SEU error detection and correction, clock networks with PLL clock sources, and other system‑level features important for robust designs.
  • Compliance  RoHS compliant.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems, leveraging the device’s logic density and transceiver capabilities.
  • Wireline and Optical Networking  40G/100G muxponders, transponders and 100G line cards using on‑chip hard IP for high‑speed serial protocols.
  • Broadcast and Pro AV  Studio switches, transport servers, and videoconferencing equipment that require large on‑chip memory and flexible I/O.
  • Computing and Storage  Server acceleration, flash cache, and cloud computing applications that benefit from high logic capacity and embedded RAM.
  • Defense and Secure Communications  Applications such as radar, electronic warfare, and secure communications where reconfiguration, reliability features, and industrial temperature operation are important.

Unique Advantages

  • High Logic Density:  570000 logic elements enable implementation of large, complex FPGA designs without immediate need for multi‑device partitioning.
  • Substantial On‑Chip Memory:  42,082,304 bits of embedded RAM reduce external memory dependence and improve data locality for high‑performance designs.
  • Broad Interface Support:  Built‑in hard IP for PCIe Gen1/2/3 and support for 10 Gbps Ethernet and Interlaken simplify integration of common high‑speed links.
  • Industrial Temperature Capability:  Rated from −40 °C to 100 °C to support deployments in demanding environments.
  • Flexible Power Domain:  Core supply range of 870 mV to 980 mV supports the device’s internal power requirements and system power management strategies.
  • System‑Level Features:  Support for dynamic and partial reconfiguration, clocking resources, PLLs, and SEU detection/correction contribute to maintainable and resilient designs.

Why Choose 10AX057K2F35I2LG?

The 10AX057K2F35I2LG Arria 10 GX FPGA combines large programmable logic capacity, significant embedded RAM, and comprehensive high‑speed interface support in a single 1152‑FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for applications that require both performance and environmental robustness.

This device is well suited to engineers and system designers building mid‑range, high‑performance systems in communications, broadcast, computing, medical, and defense markets who need scalable logic, on‑chip memory, and integrated protocol support with the flexibility of FPGA reconfiguration.

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