10AX057K2F35I2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 42082304 570000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,000 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 9 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 396 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 217080 | Number of Logic Elements/Cells | 570000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 42082304 |
Overview of 10AX057K2F35I2LG – Arria 10 GX FPGA, 570000 logic elements, 396 I/O, 1152‑FCBGA
The 10AX057K2F35I2LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 1152‑FCBGA (35×35) package for surface‑mount applications. This device is part of the Arria 10 family of 20 nm mid‑range FPGAs and SoCs, designed to deliver higher performance and improved power efficiency for demanding embedded and communications use cases.
With 570000 logic elements, 42,082,304 bits of embedded RAM, and 396 I/O, the device targets mid‑range systems requiring high integration, on‑chip memory capacity, and a variety of high‑speed interface options. It is specified for industrial temperature operation from −40 °C to 100 °C and RoHS compliant.
Key Features
- Logic Capacity 570000 logic elements provide very large on‑chip programmable logic resources for complex digital designs.
- Embedded Memory 42,082,304 total RAM bits available for high‑bandwidth buffering, lookup tables, and data storage on‑chip.
- I/O and Package 396 I/O pins in a high‑density 1152‑FCBGA (35×35) package designed for surface‑mount PCB assembly.
- Power Supply Core supply voltage range specified at 870 mV to 980 mV to support the device power domain requirements.
- Operating Range Industrial operating temperature from −40 °C to 100 °C to meet demanding environmental conditions.
- Transceivers and Interfaces Arria 10 GX family features listed in the device overview include low‑power serial transceivers, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and external memory interface support.
- Programmability and Reconfiguration Device overview describes support for dynamic and partial reconfiguration along with configuration and power management features.
- Reliability and System Features Datasheet content references SEU error detection and correction, clock networks with PLL clock sources, and other system‑level features important for robust designs.
- Compliance RoHS compliant.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul systems, leveraging the device’s logic density and transceiver capabilities.
- Wireline and Optical Networking 40G/100G muxponders, transponders and 100G line cards using on‑chip hard IP for high‑speed serial protocols.
- Broadcast and Pro AV Studio switches, transport servers, and videoconferencing equipment that require large on‑chip memory and flexible I/O.
- Computing and Storage Server acceleration, flash cache, and cloud computing applications that benefit from high logic capacity and embedded RAM.
- Defense and Secure Communications Applications such as radar, electronic warfare, and secure communications where reconfiguration, reliability features, and industrial temperature operation are important.
Unique Advantages
- High Logic Density: 570000 logic elements enable implementation of large, complex FPGA designs without immediate need for multi‑device partitioning.
- Substantial On‑Chip Memory: 42,082,304 bits of embedded RAM reduce external memory dependence and improve data locality for high‑performance designs.
- Broad Interface Support: Built‑in hard IP for PCIe Gen1/2/3 and support for 10 Gbps Ethernet and Interlaken simplify integration of common high‑speed links.
- Industrial Temperature Capability: Rated from −40 °C to 100 °C to support deployments in demanding environments.
- Flexible Power Domain: Core supply range of 870 mV to 980 mV supports the device’s internal power requirements and system power management strategies.
- System‑Level Features: Support for dynamic and partial reconfiguration, clocking resources, PLLs, and SEU detection/correction contribute to maintainable and resilient designs.
Why Choose 10AX057K2F35I2LG?
The 10AX057K2F35I2LG Arria 10 GX FPGA combines large programmable logic capacity, significant embedded RAM, and comprehensive high‑speed interface support in a single 1152‑FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for applications that require both performance and environmental robustness.
This device is well suited to engineers and system designers building mid‑range, high‑performance systems in communications, broadcast, computing, medical, and defense markets who need scalable logic, on‑chip memory, and integrated protocol support with the flexibility of FPGA reconfiguration.
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