10AX057K3F40E2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 696 42082304 570000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,455 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 217080 | Number of Logic Elements/Cells | 570000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 42082304 |
Overview of 10AX057K3F40E2SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 570,000 logic elements
The 10AX057K3F40E2SG is an Intel Arria 10 GX family FPGA in a 1517-FCBGA (40×40) package. It is a 20 nm mid-range FPGA architecture designed for high-performance, power-efficient implementations across communications, broadcast, computing, and defense markets.
With 570,000 logic elements, extensive embedded RAM, and a large I/O count, this device targets applications requiring significant logic capacity, on-chip memory, and dense external connectivity while operating within an extended commercial temperature range.
Key Features
- Core Capacity — 570,000 logic elements provide substantial programmable logic for complex FPGA designs.
- Embedded Memory — 42,082,304 total RAM bits for on-chip storage and buffering needs.
- I/O Density — 696 I/O pins to support dense, multi-channel interfacing and external memory or peripheral connectivity.
- Package & Mounting — 1517-BBGA / 1517-FCBGA (40×40) surface-mount package for compact board-level integration.
- Power Supply Range — Core voltage supply range of 870 mV to 930 mV to match low-voltage system architectures.
- Operating Temperature — Extended grade operation from 0 °C to 100 °C for a wide set of commercial and mid-temperature applications.
- Family Architecture — Arria 10 device family characteristics include 20 nm process, adaptive logic module architecture, variable-precision DSP blocks, and configurable clock networks and PLLs.
- Embedded System & I/O Features — Family-level features include PCIe Gen1/2/3 hard IP, low-power serial transceivers, and support for high-speed Ethernet and external memory interfaces as described in the device overview.
- Compliance — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Use in channel and switch cards for remote radio heads and mobile backhaul where performance and power efficiency are required.
- Wireline and Networking — Suitable for 40G/100G muxponders, transponders, and line cards where high I/O density and embedded memory accelerate packet processing and bridging.
- Broadcast and Professional AV — Studio switches, servers, and videoconferencing equipment that need configurable logic and substantial on-chip memory for media processing.
- Computing and Storage — Flash cache, cloud server acceleration, and server-side offload applications leveraging large logic capacity and embedded RAM.
- Medical and Defense Systems — Diagnostic imaging, radar, and electronic warfare subsystems that benefit from the Arria 10 family’s balance of performance and power efficiency.
Unique Advantages
- High Logic Density: 570,000 logic elements accommodate large, feature-rich FPGA designs without immediate migration to higher families.
- Significant On-Chip Memory: 42,082,304 bits of embedded RAM reduce dependence on external memory for buffering and caching.
- Extensive External Connectivity: 696 I/Os enable multiple interfaces and high channel counts for networking and processing applications.
- Compact, Board-Friendly Package: 1517-FCBGA (40×40) surface-mount package supports dense PCB layouts while maintaining thermal and signal routing considerations.
- Power-Efficient Operation: Family-level power-saving technologies combined with a low core voltage range (870 mV–930 mV) help reduce overall system power.
- Extended Temperature Range: Rated 0 °C to 100 °C to support a broad range of commercial deployment scenarios.
Why Choose 10AX057K3F40E2SG?
The 10AX057K3F40E2SG delivers a balanced combination of high logic capacity, large embedded RAM, and extensive I/O in a compact FCBGA package. It is positioned for mid-range designs that require significant programmable resources and robust interfacing options while benefiting from the Arria 10 family’s performance and power-efficiency features.
This device is well suited to engineers developing communications equipment, high-speed networking, media processing, and compute-acceleration designs who need a scalable, documented FPGA platform backed by Intel’s Arria 10 device overview and specifications.
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