10AX057K3F40E2SG

IC FPGA 696 I/O 1517FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 696 42082304 570000 1517-BBGA, FCBGA

Quantity 1,455 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs217080Number of Logic Elements/Cells570000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits42082304

Overview of 10AX057K3F40E2SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 570,000 logic elements

The 10AX057K3F40E2SG is an Intel Arria 10 GX family FPGA in a 1517-FCBGA (40×40) package. It is a 20 nm mid-range FPGA architecture designed for high-performance, power-efficient implementations across communications, broadcast, computing, and defense markets.

With 570,000 logic elements, extensive embedded RAM, and a large I/O count, this device targets applications requiring significant logic capacity, on-chip memory, and dense external connectivity while operating within an extended commercial temperature range.

Key Features

  • Core Capacity — 570,000 logic elements provide substantial programmable logic for complex FPGA designs.
  • Embedded Memory — 42,082,304 total RAM bits for on-chip storage and buffering needs.
  • I/O Density — 696 I/O pins to support dense, multi-channel interfacing and external memory or peripheral connectivity.
  • Package & Mounting — 1517-BBGA / 1517-FCBGA (40×40) surface-mount package for compact board-level integration.
  • Power Supply Range — Core voltage supply range of 870 mV to 930 mV to match low-voltage system architectures.
  • Operating Temperature — Extended grade operation from 0 °C to 100 °C for a wide set of commercial and mid-temperature applications.
  • Family Architecture — Arria 10 device family characteristics include 20 nm process, adaptive logic module architecture, variable-precision DSP blocks, and configurable clock networks and PLLs.
  • Embedded System & I/O Features — Family-level features include PCIe Gen1/2/3 hard IP, low-power serial transceivers, and support for high-speed Ethernet and external memory interfaces as described in the device overview.
  • Compliance — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Use in channel and switch cards for remote radio heads and mobile backhaul where performance and power efficiency are required.
  • Wireline and Networking — Suitable for 40G/100G muxponders, transponders, and line cards where high I/O density and embedded memory accelerate packet processing and bridging.
  • Broadcast and Professional AV — Studio switches, servers, and videoconferencing equipment that need configurable logic and substantial on-chip memory for media processing.
  • Computing and Storage — Flash cache, cloud server acceleration, and server-side offload applications leveraging large logic capacity and embedded RAM.
  • Medical and Defense Systems — Diagnostic imaging, radar, and electronic warfare subsystems that benefit from the Arria 10 family’s balance of performance and power efficiency.

Unique Advantages

  • High Logic Density: 570,000 logic elements accommodate large, feature-rich FPGA designs without immediate migration to higher families.
  • Significant On-Chip Memory: 42,082,304 bits of embedded RAM reduce dependence on external memory for buffering and caching.
  • Extensive External Connectivity: 696 I/Os enable multiple interfaces and high channel counts for networking and processing applications.
  • Compact, Board-Friendly Package: 1517-FCBGA (40×40) surface-mount package supports dense PCB layouts while maintaining thermal and signal routing considerations.
  • Power-Efficient Operation: Family-level power-saving technologies combined with a low core voltage range (870 mV–930 mV) help reduce overall system power.
  • Extended Temperature Range: Rated 0 °C to 100 °C to support a broad range of commercial deployment scenarios.

Why Choose 10AX057K3F40E2SG?

The 10AX057K3F40E2SG delivers a balanced combination of high logic capacity, large embedded RAM, and extensive I/O in a compact FCBGA package. It is positioned for mid-range designs that require significant programmable resources and robust interfacing options while benefiting from the Arria 10 family’s performance and power-efficiency features.

This device is well suited to engineers developing communications equipment, high-speed networking, media processing, and compute-acceleration designs who need a scalable, documented FPGA platform backed by Intel’s Arria 10 device overview and specifications.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical information for part 10AX057K3F40E2SG.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up