10AX057N2F40E1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 588 42082304 570000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 633 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 588 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 217080 | Number of Logic Elements/Cells | 570000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 42082304 |
Overview of 10AX057N2F40E1SG – Arria 10 GX FPGA, 1517-FCBGA (40×40)
The 10AX057N2F40E1SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package. It is built on the Arria 10 device architecture for 20 nm mid-range FPGA/SoC applications and targets high-performance, power-sensitive designs across communications, broadcast, computing, medical, and defense markets.
With large on-chip logic and memory resources plus high I/O density, this device is suited to system-level functions such as packet processing, high-speed interfaces, signal processing, and acceleration tasks where integration and power efficiency matter.
Key Features
- Process and Family Arria 10 GX device family based on a 20 nm mid-range FPGA architecture providing a balance of performance and power efficiency, as described in the device overview.
- Logic Capacity 570,000 logic elements to implement complex custom logic, state machines, and data-paths.
- Embedded Memory 42,082,304 total RAM bits for on-chip buffering, caches, and memory-mapped logic storage.
- I/O and System Interfaces 588 general-purpose I/O pins to support wide external interfacing and high-density system connections.
- Transceiver and Interface Capabilities Device overview describes support for high-speed serial transceivers and hard IP for common standards such as PCIe and 10 Gbps Ethernet, enabling integration of serial links and protocol interfaces.
- Power Core voltage supply range of 870 mV to 980 mV to support low-voltage, power-optimized system designs.
- Package and Mounting 1517-FCBGA (1517-BBGA) package, 40×40 mm, surface-mount for compact board-level integration.
- Operating Conditions & Grade Extended grade with an operating temperature range of 0 °C to 100 °C and RoHS compliance for environmental standards.
Typical Applications
- Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul where programmable logic and DSP capabilities are used for modulation, timing, and aggregation functions.
- Wireline networking — Line cards, muxponders, and transponders (40G/100G) that require high-density I/O and embedded memory for packet buffering and protocol handling.
- Broadcast and media processing — Studio switches, video transport, and professional audio/video processing that benefit from large logic capacity and on-chip RAM for low-latency pipelines.
- Compute and storage acceleration — Server acceleration and flash cache applications where programmable fabric and embedded memory accelerate data-path processing and offload tasks from general-purpose CPUs.
- Medical and defense systems — Diagnostic imaging, radar, and electronic warfare subsystems that use programmable logic for signal processing and custom control logic.
Unique Advantages
- High logic density: 570,000 logic elements enable complex custom functions and significant on-chip programmability to consolidate system functions.
- Large on-chip memory: Over 42 million RAM bits provide substantial buffering and local storage to support high-throughput pipelines and caches.
- High I/O count: 588 I/O pins support dense external connectivity for multi-channel interfaces and wide parallel buses.
- Low-voltage operation: Core supply between 870 mV and 980 mV facilitates power-optimized designs for energy-sensitive applications.
- System integration in compact package: 1517-FCBGA (40×40) surface-mount package simplifies board integration while accommodating the device’s dense resources.
- Extended operating range and compliance: Extended grade with 0 °C to 100 °C operation and RoHS compliance for broader deployment environments.
Why Choose 10AX057N2F40E1SG?
The 10AX057N2F40E1SG places substantial logic, memory, and I/O resources into a compact FCBGA package, delivering a balanced platform for mid-range, performance-sensitive FPGA applications. Its Arria 10 GX family heritage and 20 nm architecture provide the resource mix needed for protocol processing, data-path acceleration, and complex signal-processing tasks.
This part is well suited for design teams needing scalable programmable logic with significant on-chip RAM, high I/O density, and low-voltage operation, backed by Intel’s Arria 10 device documentation and product support materials.
Request a quote or submit an inquiry to learn availability, lead times, and pricing for the 10AX057N2F40E1SG.

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