10AX057N2F40E1SG

IC FPGA 588 I/O 1517FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 588 42082304 570000 1517-BBGA, FCBGA

Quantity 633 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O588Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs217080Number of Logic Elements/Cells570000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits42082304

Overview of 10AX057N2F40E1SG – Arria 10 GX FPGA, 1517-FCBGA (40×40)

The 10AX057N2F40E1SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package. It is built on the Arria 10 device architecture for 20 nm mid-range FPGA/SoC applications and targets high-performance, power-sensitive designs across communications, broadcast, computing, medical, and defense markets.

With large on-chip logic and memory resources plus high I/O density, this device is suited to system-level functions such as packet processing, high-speed interfaces, signal processing, and acceleration tasks where integration and power efficiency matter.

Key Features

  • Process and Family Arria 10 GX device family based on a 20 nm mid-range FPGA architecture providing a balance of performance and power efficiency, as described in the device overview.
  • Logic Capacity 570,000 logic elements to implement complex custom logic, state machines, and data-paths.
  • Embedded Memory 42,082,304 total RAM bits for on-chip buffering, caches, and memory-mapped logic storage.
  • I/O and System Interfaces 588 general-purpose I/O pins to support wide external interfacing and high-density system connections.
  • Transceiver and Interface Capabilities Device overview describes support for high-speed serial transceivers and hard IP for common standards such as PCIe and 10 Gbps Ethernet, enabling integration of serial links and protocol interfaces.
  • Power Core voltage supply range of 870 mV to 980 mV to support low-voltage, power-optimized system designs.
  • Package and Mounting 1517-FCBGA (1517-BBGA) package, 40×40 mm, surface-mount for compact board-level integration.
  • Operating Conditions & Grade Extended grade with an operating temperature range of 0 °C to 100 °C and RoHS compliance for environmental standards.

Typical Applications

  • Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul where programmable logic and DSP capabilities are used for modulation, timing, and aggregation functions.
  • Wireline networking — Line cards, muxponders, and transponders (40G/100G) that require high-density I/O and embedded memory for packet buffering and protocol handling.
  • Broadcast and media processing — Studio switches, video transport, and professional audio/video processing that benefit from large logic capacity and on-chip RAM for low-latency pipelines.
  • Compute and storage acceleration — Server acceleration and flash cache applications where programmable fabric and embedded memory accelerate data-path processing and offload tasks from general-purpose CPUs.
  • Medical and defense systems — Diagnostic imaging, radar, and electronic warfare subsystems that use programmable logic for signal processing and custom control logic.

Unique Advantages

  • High logic density: 570,000 logic elements enable complex custom functions and significant on-chip programmability to consolidate system functions.
  • Large on-chip memory: Over 42 million RAM bits provide substantial buffering and local storage to support high-throughput pipelines and caches.
  • High I/O count: 588 I/O pins support dense external connectivity for multi-channel interfaces and wide parallel buses.
  • Low-voltage operation: Core supply between 870 mV and 980 mV facilitates power-optimized designs for energy-sensitive applications.
  • System integration in compact package: 1517-FCBGA (40×40) surface-mount package simplifies board integration while accommodating the device’s dense resources.
  • Extended operating range and compliance: Extended grade with 0 °C to 100 °C operation and RoHS compliance for broader deployment environments.

Why Choose 10AX057N2F40E1SG?

The 10AX057N2F40E1SG places substantial logic, memory, and I/O resources into a compact FCBGA package, delivering a balanced platform for mid-range, performance-sensitive FPGA applications. Its Arria 10 GX family heritage and 20 nm architecture provide the resource mix needed for protocol processing, data-path acceleration, and complex signal-processing tasks.

This part is well suited for design teams needing scalable programmable logic with significant on-chip RAM, high I/O density, and low-voltage operation, backed by Intel’s Arria 10 device documentation and product support materials.

Request a quote or submit an inquiry to learn availability, lead times, and pricing for the 10AX057N2F40E1SG.

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