10AX066N4F40E3SG

IC FPGA 588 I/O 1517FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 588 49610752 660000 1517-BBGA, FCBGA

Quantity 64 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O588Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250540Number of Logic Elements/Cells660000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49610752

Overview of 10AX066N4F40E3SG – Arria 10 GX Field Programmable Gate Array (FPGA), 1517-FCBGA

The 10AX066N4F40E3SG is an Intel Arria 10 GX series FPGA device built on a 20 nm process. It combines high logic capacity, large embedded memory, and extensive I/O in a surface-mount 1517-FCBGA (40×40) package for midrange, performance-sensitive designs.

Targeted at high-performance, power-sensitive midrange applications, this extended-grade device offers a balance of integration and scalability for communications, compute, broadcast, and advanced imaging systems.

Key Features

  • Logic Capacity  Provides 660,000 logic elements for complex programmable logic and system-level integration.
  • Embedded Memory  Includes 49,610,752 total RAM bits to support large buffering, on-chip caches, and memory-intensive functions.
  • I/O Density  588 general-purpose I/O pins allow broad external interfacing and high connectivity for multi-channel designs.
  • Transistor Process and Architecture  Part of the Intel Arria 10 family of 20 nm mid-range FPGAs and SoCs, designed for performance and power efficiency.
  • Power Supply  Operates with supply rails in the range of 870 mV to 930 mV for core power planning and regulator selection.
  • Package & Mounting  1517-BBGA / 1517-FCBGA (40×40) package, surface-mount mounting type for compact board-level deployment.
  • Temperature & Grade  Extended grade device rated for 0 °C to 100 °C operation to meet robust commercial and industrial-adjacent thermal profiles.
  • Compliance  RoHS compliant for environmentally regulated designs.

Typical Applications

  • Wireless infrastructure  Channel and baseband processing where dense logic and embedded memory are used for signal processing and backhaul functions.
  • High-speed wireline networking  Line cards, muxponders, and transponders that require substantial logic, memory, and I/O for 40G/100G aggregation and protocol handling.
  • Compute and storage acceleration  On-platform acceleration, flash cache controllers, or offload engines benefiting from large on-chip RAM and programmable logic.
  • Broadcast and professional AV  Video and audio transport, switching, and processing applications that need flexible I/O and substantial on-device memory.

Unique Advantages

  • High integration density: 660,000 logic elements combined with nearly 50 million RAM bits reduces the need for external logic and memory, simplifying BOM and board area.
  • Extensive I/O capability: 588 I/O pins enable multi-channel interfacing and complex system connectivity without additional bridge devices.
  • Compact, board-ready package: 1517-FCBGA (40×40) surface-mount package supports high-density PCB layouts for space-constrained systems.
  • Designed for power-sensitive midrange designs: Arria 10 family heritage on 20 nm process emphasizes performance-per-watt for applications that require both throughput and efficiency.
  • Extended operating range: 0 °C to 100 °C rating and RoHS compliance provide a balance of environmental robustness and regulatory conformance.

Why Choose 10AX066N4F40E3SG?

The 10AX066N4F40E3SG positions itself as a high-capacity, midrange FPGA solution that consolidates logic, memory, and I/O in a single, extended-grade package. Its specification set supports complex signal processing, networking, and compute-acceleration tasks where on-chip resources and dense external connectivity reduce system complexity.

For teams designing communications equipment, broadcast systems, or compute accelerators, this Arria 10 GX device offers a scalable platform backed by documented family features and device-level specifications to plan power, thermal, and board integration with confidence.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 10AX066N4F40E3SG FPGA for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up